E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided licensing and consulting services in semiconductor packaging since 1987. She is the editor of Surface Mount Technology: Recent Japanese Developments, co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbun), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China. She is a member of IEEE CPMT, IMAPS, SMTA, and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. She received her B.A. in Economics and Business from Mercer University in Macon, Georgia in 1979 and her M.A. in Economics from the University of Texas at Austin in 1981. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
Dr. Frank J. Bachner, Senior Analyst specializes in electronic materials and advanced packaging. Before becoming a consultant, Dr. Bachner was the Director, Advanced Product Programs at Alcoa Electronic Packaging, Inc., a manufacturer of ceramic pin grid arrays for microprocessor application. Before joining Alcoa, he worked in marketing and product development related to advanced packaging at Ceramics Process Systems and Engelhard Corporation. Dr. Bachner received his S.B. and Ph.D. degrees from the Massachusetts Institute of Technology in Cambridge, Massachusetts (MIT). Following receipt of his doctorate, he was responsible for research programs in silicon device technology, thin films, and advanced packaging at the MIT Lincoln Laboratory. He is a member of IEEE CPMT and IMAPS.
Karen Carpenter, Senior Analyst is the former marketing manager for IBM Interconnect Products Group and the former Director of Marketing for Endicott Interconnect Technologies. During her 21-year career at IBM, she held positions in engineering, finance, strategic planning, and marketing management, spanning the areas of chip packaging, printed circuit boards, and electronic assembly. She is a member of the IPC and serves on its Technology Marketing Research Council steering committee. She received the IPC President’s Award and was nominated as one of the Atomic 29 most influential people in the IMS/PCB industry. She received her B.S. in chemistry from State University of New York and received her marketing education through IBM’s professional development programs. She has several technical and business publications, holds several U.S. patents related to the electronic packaging industry, and is the author of a quarterly column, Marketing Matters, for Circuitree magazine.
Charles Cohn, Senior Analyst was a Distinguished Member of Technical Staff in the IC Packaging and Interconnection Organization at Agere Systems. He held positions with AT&T/Lucent/Agere for 23 years and was the lead resource on PCB technology supporting the development of advanced organic PBGA substrates for wire bonded and flip chip IC interconnections. He maintained close relationships with a broad spectrum of organic substrate suppliers worldwide and continually assessed the latest technologies and manufacturing capabilities. Before joining AT&T, he was an engineering specialist at the Singer/Kearfott Company, involved in electronic packaging and thermal design of airborne electronic modules and inertial navigation systems for the military. He has authored chapters in several McGraw Hill IC Packaging Handbooks, co-edited a McGraw Hill book titled Failure-Free IC Packages, and conducted many seminars and presented numerous papers on electronic packaging. He holds eight U.S. patents and three patents pending on IC packaging construction and thermal enhancements. He holds B.S., M.S., and M.E. degrees in mechanical engineering from Columbia University in New York, New York and has a New Jersey Professional Engineering License.
Dr. Timothy G. Lenihan, Senior Analyst earned his B.S. degrees in Physics and Mathematics from Wheeling College, West Virginia in 1974, his M.S degree in Solid State Physics from DePaul University in 1978, and his Ph.D. in Electrical Engineering from the University of Arkansas in 1996. He spent 15 years at IBM, first as development manager of microelectronics and manufacturing engineering manager, then as the director of manufacturing engineering, R&D and sales and marketing at Sheldahl. He pioneered the development of a low-cost/high-performance integrated passive packaging technology that incorporates multilayered flex material with capacitor, resistor and inductor devices embedded in the electronic package. He is a Senior Member of IEEE CPMT and a member of IMAPS and the New York Academy of Science. He is also an Adjunct Faculty member in the Department of Electrical Engineering at the University of Arkansas, and has published over 70 papers in journals and technical conference proceedings.
Linda C. Matthew, Senior Analyst, obtained her B.S. and M.S. degrees in Materials Science and Engineering from the Massachusetts Institute of Technology in 1985 and 1986, respectively. She spent seven years as a development engineer at the IBM Watson Research Center in New York. In 1993 she joined Tessera, Inc. and moved to California, where she was responsible first for development, and later for Technical Marketing of the uBGA. She subsequently worked at nCHIP and at LSI Logic as a Product Marketing Manager for packaging.
Linda has several publications and is named on seven U.S. and four foreign patents. She has served as president of the local IEEE CPMT chapter, and also on the committee of the International Electronics Manufacturing Technology (IEMT) symposium for four years.
Robert (Bob) Munroe, Senior Analyst, was Section Manager of Applications Support, Motorola Semiconductor Products Sector, Austin, Texas. He was responsible for providing board-level solder-joint reliability information on integrated circuit packages, especially array packages. His team also assisted customers with assembly problems and identified board-level related tests for new product packages including BGAs. He joined Motorola in 1991 after 30 years with IBM. His career has encompassed electronic packaging from components to small systems and includes 20 years experience in military and aerospace mechanical engineering, and performed graduate studies at Harvard College in engineering physics. He holds two patents and has a number of publications in the field of electronic packaging. He is a member of IEEE CPMT.