TechSearch International | Advanced Packaging Update

Volume 2-0115

January 2015

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The second volume of the Advanced Packaging Update provides an economic outlook for the electronics industry and describes the latest trends in substrates for flip chip BGAs and CSPs. A discussion on alternatives to silicon interposers, including glass and laminate interposers, is provided. TechSearch International’s annual survey on substrate design rules is highlighted, providing special coverage from suppliers of organic flip chip BGA and CSP substrates, PBGAs, and laminate CSPs (FBGAs) worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish.

Contents…
1. Industry and Economic Trends

1.1. Economic Trends

1.1.1. Macroeconomic Trends

2. Advances in Laminate Substrates

2.1. Flip Chip PBGA

2.1.1. High-Performance Processors

2.1.2. Network and Server ASICs

2.2. Flip Chip CSP

2.3. Coreless Substrates

2.4. Organic Interposers

3. Glass Interposers

3.1. Glass Via Fabrication

3.2. TGV Interposer Demonstrations

Asahi Glass Company, Corning, Dia Nippon Printing, EPWorks, NTK, Shinko Electric Industries, SCHOTT Glass, Unimicron, 3D Glass Solutions

3.3. Silicon Interposer Alternatives

3.3.1. Xilinx SLIT

3.3.2. Embedded Silicon Structures

4. Substrate Design Rules

4.1. Today’s Laminate Feature Size

4.2. Company Design Rules

Access, ASE Materials, AT&S, Daisho Denshi, Fujitsu Interconnect Technologies, Ibiden, i3 Electronics, Japan Circuit Industrial, Kinsus Interconnect Technology, Kyocera SLC Technologies, LG Innotek, Nan Ya PCB, NTK Technologies, Samsung Electro–Mechanics, Shennan Circuits, Shinko Electric Industries, Simmtech, Toppan Printing, Unimicron Technology

Appendix: Substrate Suppliers

References
Figures…
1.1. Monthly U.S. Housing Starts

2.1. Intel's Broadwell Processor

2.2. Samsung's Exynos Octa 5433 Processor in PoP

2.3. Lid Tie Designs

3.1. Xilinx SLIT

3.2. ColoS vs. FC-EIC®
Tables…
2.1. FC-PBGA Substrate Trends

2.2. FC-CSP Substrate Trends

2.3. Properties of Dielectric Materials

2.4. Organic Substrate Requirements

2.5. Interposer Comparison

2.6. Organic Interposer Suppliers and Technology

2.7. Fine Line Organic Substrate Targets

3.1. Via Fabrication in Glass

3.2. Comparison of Glass Interposer Demonstrators

3.3. Design Rule Targets for Glass Interposers

3.4. Typical Processing Capabilities and Tolerances

4.1. Build-up FC-PBGA Substrate Suppliers

4.2. Build-up FC-CSP Substrate Suppliers

4.3. Laminate PBGA/CSP Substrate Suppliers

4.4. Design Rules for Substrate Suppliers

Advanced Packaging Update

Market and Technology Trends

Volume 2-0115

January 2015