TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 ADVANCED PACKAGING UPDATE:
Market and Technology Trends
Vol. 3, 2009
The third volume of the Advanced Packaging Update for 2009 provides an updated economic outlook and examines the general macroeconomic trends in the world economy and the microeconomic trends in the semiconductor packaging and assembly industry. This issue features the results of a survey on lidless packages. An analysis of the developments in fan-out WLPs is provided. Demand and capacity projections for fan-out packages are included. Issues associated with scaling fan-out packages to large panel format are discussed. New package and test developments are discussed.
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Advanced Packaging Update: Market and Technology Trends
Vol. 3, 2009 |
| File size: 40.0 kb |
Published: February 2010. |
| Table of Contents |
| 1 |
Industry and Economic Trends |
| 1.1 |
Economic Trends |
| 1.1.1 |
Macroeconomic Trends |
| 1.1.2 |
Recovery in the Electronics Industry |
| 1.2 |
Foundry Shipments and CAPEX Increase |
| 1.3 |
Semiconductor Packaging and Assembly |
| 2 |
Fan-out Wafer Level Packages |
| 2.1 |
Casio Micronics |
| 2.2 |
EPIC Technologies |
| 2.3 |
Fujikura |
| 2.4 |
Freescale Semiconductor/NEPES |
| 2.5 |
Infineon |
| 2.5.1 |
ASE |
| 2.5.2 |
STATS ChipPAC |
| 2.5.3 |
STMicroelectronics |
| 2.6 |
King Dragon International |
| 2.7 |
Cost Reduction by Scaling to Large Panels |
| 2.7.1 |
Die Placement for Maximum Panel Population |
| 2.7.2 |
Die Placement Accuracy |
| 2.7.3 |
Dielectric Dispense |
| 2.7.4 |
Panel Warpage |
| 2.7.5 |
Via Alignment |
| 2.7.6 |
Metal Plating |
| 2.7.7 |
Material Selection |
| 2.7.8 |
Interconnect Reliability |
| 2.7.9 |
Singulation |
| 2.7.10 |
Multilayer Build-up Layers |
| 2.7.11 |
Solder Ball Placement |
| 3 |
Trends in Lidless Flip Chip |
| 3.1 |
Types of Lidless Flip Chip |
| 3.2 |
Markets and Drivers |
| 3.3 |
Challenges of Lidless Flip Chip |
| 3.4 |
Company Activities |
| 3.4.1 |
Advanced Micro Devices |
| 3.4.2 |
Amkor Technology, Inc. |
| 3.4.3 |
Advanced Semiconductor Engineering, Inc. |
| 3.4.4 |
Cisco Systems, Inc. |
| 3.4.5 |
Dow Corning Corporation |
| 3.4.6 |
Fujitsu Integrated MicroTechnology Ltd. |
| 3.4.7 |
Global Unichip Corporation |
| 3.4.8 |
Intel Corporation |
| 3.4.9 |
LSI Corporation |
| 3.4.10 |
Qualcomm Incorporated |
| 3.4.11 |
Siliconware Precision Industries Co., Ltd. |
| 3.4.12 |
STATS ChipPAC, Ltd. |
| 3.4.13 |
Sun Microsystems |
| 3.4.14 |
Texas Instruments, Inc. |
| 3.4.15 |
Xilinx, Inc. |
| 4 |
New Test Developments |
| 4.1 |
Package-Centric Testing |
| 4.2 |
Test-in-Tray |
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| List of Figures |
| 1.1. |
Monthly U.S. housing starts. |
| 2.1. |
WLP die size and I/O counts. |
| 2.2. |
Infineon’s eWLB. |
| 2.3. |
Projected demand and capacity for eWLB (200mm wafers). |
| 2.4. |
Chips in substrate package. |
| 3.1. |
Lidless flip chip. |
| 3.2. |
Amkor's peripherally molded FCMBGA. |
| 3.3. |
Cross-section of Amkor's FCMBGA. |
| 3.4. |
TI's flat and top-hat lids. |
| 4.1. |
Teseda's V550 hardware platform. |
| 4.2. |
FlexFrame carrier for standardized back-end transport. |
| 4.3. |
FlexFrame carrier for MEMs pressure sensors. |
| List of Tables |
| 2.1. |
Semiconductor Packaging Materials Market |
| 3.1. |
Reliability Testing Results for Amkor's FCMBGA |
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