Volume 1-1015

October 2015
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The first volume of the Advanced Packaging Update features special coverage of the latest developments in fan-out wafer level packages (FO-WLPs), including applications and suppliers. A market forecast is provided, including a break out for high-density FO-WLP. The latest developments in silicon interposers are presented and a new market forecast is included. A major section of the report is focused on autonomous driving and the latest automotive safety features, including packaging trends. An economic analysis examines macroeconomic trends and their impact on the semiconductor packaging and assembly industry.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Semiconductor Sector
        • 1.2.1 OSAT CAPEX Plans
        • 1.2.2 Consolidation in the Semiconductor Industry
    • 2 Silicon Interposer Developments
      • 2.1 AMD's Graphics Application
      • 2.2 nVIDIA
      • 2.3 Xilinx
      • 2.4 Silicon Interposer Market Forecast
    • 3 FO-WLP Applications and Drivers
      • 3.1 FO-WLP Advantages
      • 3.2 FO-WLP Suppliers
        • 3.2.1 Face-up or Face-down
        • 3.2.2 Die Last FO-WLP Solutions
      • 3.3 Panel-level FO-WLP
    • 4 Automotive ADAS
      • 4.1 ADAS
      • 4.2 ADAS Components
        • 4.2.1 Image Sensors
          • 4.2.1.1 Image Sensor Functions
          • 4.2.1.2 Image Sensor Packaging Trends for Automotive
        • 4.2.2 Radar-based Sensors
          • 4.2.2.1 Millimeter Wave Radar
          • 4.2.2.2. LIDAR
          • 4.2.2.3 Ultrasonic Sensors
        • 4.2.3 Impact Sensors
        • 4.2.4 Processors
      • 4.3 Automotive Packaging Reliability Requirements
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts
    • 1.2 Global semiconductor M&A deal values in 1996-2015
    • 2.1 AMD's Fiji with silicon interposer and HBM
    • 2.2 Manufacturing process flow for AMD's Fiji
    • 2.3 TSMC CoWoS™ process
    • 3.1 Infineon eWLB for LTE backhaul transceiver
    • 3.2 CoWoS™ process leveraged for InFO PoP
    • 3.3 Single-chip and dual-chip InFO PoP with TIV
    • 3.4 M-Series FO-WLP
    • 4.1 Factor study for traffic accidents
    • 4.2 Automotive image sensor packaging trends
    • 4.3 Sony stacked CMOS image sensor
    • 4.4 Power comparison between traditional and stacked sensor
    • 4.5 Typical ultrasonic sensor locations for parking assist
    • 4.6 Impact detection sensor size trends
    • 4.7 Quality and reliability in 125°C mission profile component
  • Tables…
    • 1.1 Subcontractor CAPEX growth (millions of dollars)
    • 2.1 TSV interposer market projections
    • 3.1 FO-WLP market projections
    • 3.2 High-density FO-WLP market projections
    • 3.3 Reconstituted wafer FO-WLP suppliers
    • 4.1 Technology used in driver assist features
    • 4.2 Driving automation sensor technologies
    • 4.3 AEC-Q100 grades vary based on the operating environment temperature range
    • 4.4 AEC-Q100 qualification tests
    • 4.5 Automotive vs. consumer potential differences
Stacks Image 25201
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  • Published October 2015
  • 40 pages
  • 16 figures / 10 tables
  • 36 PowerPoint slides
  • $4,995 annual subscription (4 issues)
    $2,500 single issue
    $8,500 corporate license
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