The Advanced Packaging Update (2-0316) describes the latest trends in laminate substrates for flip chip BGAs and CSPs. An update on silicon interposers and alternatives, including organic interposers, is also provided. TechSearch International’s annual survey on substrate design rules includes substrate design rules from suppliers of organic flip chip BGA and CSP substrates, PBGAs, and laminate CSPs (FBGAs) worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. A special feature section examines the growing market for fingerprint sensors with detailed examples.