Volume 3-0515

May 2015
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The third volume of the Advanced Packaging Update provides an analysis of the outsourced assembly and test (OSAT) industry with revenue trends and planned CAPEX for 2015. A special section focuses on the alternatives to substrates with through silicon vias (TSVs) for split die applications. The report examines trends in power packages with a special section on Cu clip packages. A market update for embedded components is included. An economic outlook based on key economic indicators is provided.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
        • 1.1.1 U.S. Macroeconomic Trends
        • 1.1.2 Growth in the Electronics Industry
    • 2 Split Die Package Options
      • 2.1 Amkor's SLIM™
      • 2.2 Amkor's SWIFT™
      • 2.3 Intel's EMIB
      • 2.4 SPIL's NTI
      • 2.5 Xilinx SLIT
    • 3 Developments in Power Packages
      • 3.1 Automotive Electronics
        • 3.1.1 Low-Power Packages​
        • 3.1.2 Embedded Components
          • 3.1.2.1 ResearchActivities
          • 3.1.2.2 Challenges in Automotive Applications
            • 3.1.2.2.1 Temperature
            • 3.1.2.2.2 Isolation Resistance
            • 3.1.2.2.3 Moisture Susceptibility
            • 3.1.2.2.4 Safety Requirements
    • ​​​4 Copper Clip Packages
      • 4.1 Companies Offering Cu Clip Packages
        • Fairchild Semiconductor, Infineon, NXP, ON Semiconductor, TI, Vishay Siliconix
      • 4.2 Assembly Services
        • Amkor, ASE, Carsem, Integrated Microelectronics, J-Devices, Nantong Fujitsu Microelectronics, UTAC
      • 4.3 Die Attach Material Developments
    • 5 Embedded Die Updates
      • ASE, AT&S, Dai Nippon Printing, FlipChip International, Fujikura, GE, Ibiden, Infineon, J-Devices, Kinsus, MST Group, Samsung Electro-Mechanical Company, Schweizer Electronic, Shinko Electric Company, Taiyo Yuden, TDK, TI, Unimicron, Würth Elektronik
  • Figures…
    • 1.1 Monthly U.S. housing starts
    • 2.1 SLIM™ process flow
    • 2.2 SWIFT™ process flow
    • 2.3 Intel EMIB
    • 2.4 NTI-PoP process flow
    • 3.1 Embedding with thin full area B-stage resin
    • 3.2 Prepreg with glass fiber for chip attach and cavity embedding
    • 4.1 TI's PowerStack™ with Cu clip
    • 4.2 FET package with Cu clip
    • 4.3 Dual-die FET package with Cu clip
    • 4.4 Paste with coated Cu composite particles
    • 5.1 Infineon DrBlade with embedded die
    • 5.2 MCeP®
    • 5.3 TI's MicroSiP
  • Tables…
    • 1.1 IC Package Subcontractor Revenue
    • 1.2 Major OSAT Revenue
    • 1.3 Subcontractor CAPEX Growth
    • 2.1 Interposer Solutions without TSVs
    • 3.1 Demand for High Heat-Resistance Technology
    • 3.2 Package Miniaturization, Power Package
    • 3.3 Power High Heat-Resistance Technology Roadmap
    • 4.1 Comparison of Cu Wire, Al Wire, and Cu Clip
    • 4.2 Market Growth for Cu Clip Packages
    • 4.3 ON Semiconductor Packages Using Cu Clip
    • 5.1 Embedded Active and Passive Packages
Stacks Image 25174
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  • Published May 2015
  • 38 pages
  • 13 figures / 11 tables
  • 30 PowerPoint slides
  • $4,200 annual subscription (4 issues)
    $1,500 single issue
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