Volume 3-0716

July 2016
order form
The Advanced Packaging Update (3-0716) features an explanation of the drivers for fan-out wafer level packages (FO-WLPs) in high volume manufacturing and analysis of economic and technical issues that need to be addressed in large area panel production. Special coverage of trends in packaging and assembly for wearable electronics is provided. Recent developments in battery technology are included. An economic analysis examines macroeconomic trends and their impact on the semiconductor packaging and assembly industry.
  • Contents…
    • 1 Industry and Economic Trends
      • ​1.1 Economic Trends
      • 1.2 Semiconductor Sector
    • ​2 FO-WLP and Large Area Processing
      • 2.1 FO-WLP Applications and Adoption Drivers
        • 2.1.1 Baseband Processors, Modems, and RF
        • 2.1.2 Automotive Radar Modules
        • 2.1.3 Application Processors and Memory for Mobile
      • 2.2 Large Area Panel Processing
      • 2.3 Consortia for Panel Processing
        • 2.3.1 Fraunhofer's FO-PLP Consortium
        • 2.3.2 FOPLP Large Panel Consortium
      • 2.4 Supplier Plans for Large Area FO-WLP
      • 2.5 FO-WLP Market Forecast
    • 3 Package Trends for Wearables
      • 3.1 Fitness/Activity Trackers and Smartwatches
        • 3.1.1 Package Trends
        • 3.1.2 Fitness/Activity Packages
        • 3.1.3 Smartwatch Packages
      • 3.2 Virtual and Augmented Reality Headsets
        • 3.2.1 Packages in VR Systems
        • 3.2.2 Packages in AR Headsets and Glasses
      • 3.3 Body Cameras and Wireless Earbuds
    • 4 Battery Technology Developments
      • 4.1 Consumer Needs
      • 4.2 Future Solutions
        • 4.2.1 Commercial Products
        • 4.2.2 Research Phase Technologies
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts
    • 2.1 Qualcomm's audio CODEC in Samsung Galaxy
    • 2.2 AP and IPM in FO-WLP
    • 2.3 Populated board for Microsoft's Band 2
    • 2.4 Samsung Gear S2
  • Tables…
    • 2.1 Thermal Performance Comparison
    • 2.2 Panel FO-WLP Cost Advantage
    • 2.3 FO-WLP Panel Sizes Under Development
    • 2.4 FO-WLP Market Projections
    • 3.1 Fitness/Activity Tracker Package Trends
    • 3.2 Packages in Microsoft Band 2
    • 3.3 Package Count in Apple Watch
    • 3.4 Package Count in LG Watch Urbane
    • 3.5 Package Count in Sun S2
    • 3.6 Virtual Reality and Augmented Reality Compared
    • 3.7 Packages in the HTC Vive System
    • 3.8 Packages in Narrative Clip
    • 3.9 Chips in Bragi Dash
    • 4.1 Selected Battery Research Activities
Stacks Image 25201
brochure
  • Published July 2016
  • 32 pages
  • 5 figures / 14 tables
  • 28 PowerPoint slides
  • $4,995 annual subscription (4 issues)
    $2,500 single issue
    $8,500 corporate license
Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
Network
Contact
  • email message
  • +1.512.372.8887
  • +1.512.372.8889
  • 4801 Spicewood Springs Rd, Ste 150
    Austin, TX 78759
    United States
Navigate
Copyright © 2015–2024 TechSearch International, Inc. • techsearchinc.com • all rights reserved