The Advanced Packaging Update (3-1017) features special coverage of outsourced assembly and test (OSAT) financials for the first half of the year. A detailed financial analysis of the industry is provided. Drivers for industry growth are discussed and the global economic outlook is presented. A new forecast for the fan-out wafer level package (FO-WLP) market is highlighted with explanations for market changes. Panel FO-WLP processing activities by company are included. A section on trends in copper clip packaging, including a market forecast is provided. Material developments for Pb-free clip attach are discussed. A discussion on connectivity focused on Wi-Fi modules is included.