Volume 3-1017

October 2017
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The Advanced Packaging Update (3-1017) features special coverage of outsourced assembly and test (OSAT) financials for the first half of the year. A detailed financial analysis of the industry is provided. Drivers for industry growth are discussed and the global economic outlook is presented. A new forecast for the fan-out wafer level package (FO-WLP) market is highlighted with explanations for market changes. Panel FO-WLP processing activities by company are included. A section on trends in copper clip packaging, including a market forecast is provided. Material developments for Pb-free clip attach are discussed. A discussion on connectivity focused on Wi-Fi modules is included.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Global Economic Trends
      • 1.2 U.S. Economic Trends
      • 1.3 Semiconductor Industry Growth Drivers
        • 1.3.1 Smartphone Growth Drives Unit Volumes
        • 1.3.2 Data Center Growth
        • 1.3.3 Memory Shortages Drive Price Increases
        • 1.3.4 Automotive Semiconductor Content
    • ​2 OSA Financial Analysis
      • 2.1 Assembly and Test Revenue
      • 2.2 OSAT CAPEX
      • 2.3 Strengthening of OSAT Business Profile
      • 2.4 Competitive Landscape
    • 3 FO-WLP Market Update
      • 3.1 FO-WLP Market Adoption
        • 3.1.1 Factors in Adoption Slowdown
        • 3.1.2 FO-WLP Application Growth
        • 3.1.3 Standard and High-Density FO-WLP
      • 3.2 FO-WLP Panel Level Supplier Update
        • 3.2.1 Deca Technologies
        • 3.2.2 Nepes
        • 3.2.3 Powertech Technology
        • 3.2.4 Samsung Electro-Mechanics
        • 3.2.5 Unimicron
    • 4 Copper Clip Packages
      • 4.1 Cu Clip Examples and Applications
        • 4.1.1 Single Die and Multi Die Configurations
        • 4.1.2 Throughput Improvement
      • 4.2 Cu Clip Market Forecast
      • 4.3 Companies with Cu Clip Packages
      • 4.4 Pb-free Clip Attach
    • 5 Packages for Connectivity
      • 5.1 Wi-Fi Modules
      • 5.2 New Packages for Connectivity Modules
        • 5.2.1 FO-WLP
        • 5.2.2 zGlue
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 1.2 Qualcomm proposed SiP.
    • 2.1 Range of gross margin for top 10 OSAT companies.
    • 2.2 High/low range of financial metrics for top 10 OSATs.
    • 4.1 FET package with Cu clip.
    • 5.1 Typical components in a Wi-Fi shielded SiP.
    • 5.2 zGlue module.
  • Tables…
    • 1.1 Latest Economic Growth Forecasts
    • 1.2 Smartphone Packages
    • 2.1 Top 20 OSAT Revenues
    • 2.2 Quarterly $US/Taiwan Exchange Rates
    • 2.3 OSAT Projected CAPEX
    • 3.1 Total FO-WLP Market Projections
    • 3.2 TSMC's InFO for Apple's A10 and A11 Processors
    • 3.3 Standard-Density FO-WLP Market Projections
    • 3.4 High-Density FO-WLP Market Projections
    • 3.5 FO-WLP Panel Production Plans
    • 3.6 Reliability for Fingerprint Sensor Package
    • 4.1 Market Growth for QFN Cu Clip Packages
    • 4.2 Examples of Companies Offering Cu Clip Packages
    • 4.3 OSATs with Cu Clip Attach Assembly Services
    • 4.4 Pb-free Materials for Cu Clip Attach

Brochure Coming Soon

  • Published October 2017
  • 38 pages
  • 7 figures / 15 tables
  • 35 PowerPoint slides
  • $4,995 annual subscription (4 issues)
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