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Trusted source for semiconductor packaging analysis since 1987

  • APU Vol. 2-0316

    Advanced Packaging Update
    • Latest trends in laminate substrates for flip chip BGAs/CSPs
    • Substrate design rules from suppliers worldwide
    • Examination of growing market for fingerprint sensors
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  • * NEW *

    APU Vol. 3-0716

    Advanced Packaging Update
    • FO-WLP and panel-level processing issues and potential
    • Trends in packaging and assembly for wearables
    • Recent developments in battery technology
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  • * NEW *

    SiP for Mobile & Wearable Apps

    Market Forecasts, Changing Business Model
    • Examines what’s fueling system-in-package growth
    • Medical, automotive, high-performance systems also covered
    • Business models, enabling technologies, design tools
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  • 2015 Flip Chip and WLP

    Emerging Trends & Market Forecasts
    • Full coverage of BGA and CSP markets with five-year forecast
    • Incl. stacked die CSP and package-on-package
    • Special section on the latest in singulation for thin die
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  • 3D IC Gap Analysis

    Remaining Issues, Solutions, Market Status
    • Looks at what’s holding back broad application of 3D IC
    • Covers great progress made and challenges that remain
    • New developments, market forecast, suppliers
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  • Introduction

    We are recognized around the world as a leading consulting company in the field of advanced semiconductor packaging technology.

    Our goal is to enable our clients to compete more effectively by providing accurate, relevant, and timely information on technology trends and market developments.

    We provide strategic market analysis, competitive analysis, technology trends, and evaluation of product strategies in the areas of semiconductor packaging and assembly, electronics manufacturing, and materials.

    What sets TechSearch apart from others?

    • We have close relationships with companies and industry leaders built on trust and mutual respect
    • We ask customers what they want—report content is constantly tailored to meet those needs
    • We provide complete, concise, accurate data and unbiased opinions
    • We participate in many industry conferences to share our findings and stay up-to-date on the latest innovations
    • We frequently tour PCB, EMS, and OSAT manufacturing facilities
  • Advanced Packaging Update

    The Advanced Packaging Update (4 issues per year) features special coverage of market and technology developments for BGAs, CSPs, stacked die CSPs, flip chip, and wafer level packages. Each issue includes new applications, developments in materials and assembly equipment, and new package constructions.

    Topics covered include:

    • Stacked die CSP trends
    • Packaging trends for mobile products such as smartphones including color photos and x-rays of components
    • System-in-package (SiP), multichip modules, and multichip packages
    • Interposer developments including silicon, organic, and glass
    • Reliability test results for new packages
    • New assembly materials
    • Substrate design rules and trends
    • New wafer level package versions and suppliers
    • Embedded component packages
    • Power device packages
    • DRAM packaging trends
    • Assembly issues for silicon with low-k dielectrics
    • Developments in Pb-free packaging
    the APU
  • Multi-client Analysis

    We publish a series of multi-client reports on various package technologies, including flip chip and wafer level packaging, system-in-package, 2.5D & 3D ICs, embedded components, and more.

    reports
  • Single-client Consulting

    We offer single-client consulting on a variety of advanced packaging, materials, equipment, and assembly areas.

    examples
  • Packaging Cost Models—2.5D & 3D, WLP, and more

    In partnership with SavanSys Solutions, TechSearch International provides access to valuable cost models for packaging. SavanSys develops the models and we help to calibrate the data. Available are cost models for 2.5D and 3D packaging, flip chip, wafer level packaging, and wire bond applications. The 2.5D & 3D Packaging Cost Model is the first cost model to cover the total cost and yield from fabrication of the wafer to complete assembly.

    collaborations
  • Global Packaging Materials Market Outlook

    In partnership with SEMI®, we offer a comprehensive market research study that examines semiconductor packaging trends and their impact on the packaging materials markets. Markets are quantified, new opportunities are highlighted for advanced technology nodes and emerging package form factors, and the materials market outlook is presented.

    collaborations
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IEEE Frances B. Hugle Engineering Scholarship, established by IEEE and TechSearch International

Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
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Contact
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  • +1.512.372.8887
  • +1.512.372.8889
  • 4801 Spicewood Springs Rd, Ste 150
    Austin, TX 78759
    United States