We are recognized around the world as a leading consulting company in the field of advanced semiconductor packaging technology.
Our goal is to enable our clients to compete more effectively by providing accurate, relevant, and timely information on technology trends and market developments.
We provide strategic market analysis, competitive analysis, technology trends, and evaluation of product strategies in the areas of semiconductor packaging and assembly, electronics manufacturing, and materials.
What sets TechSearch apart from others?
The Advanced Packaging Update (4 issues per year) features special coverage of market and technology developments for BGAs, CSPs, stacked die CSPs, flip chip, and wafer level packages. Each issue includes new applications, developments in materials and assembly equipment, and new package constructions.
Topics covered include:
We publish a series of multi-client reports on various package technologies, including flip chip and wafer level packaging, system-in-package, 2.5D & 3D ICs, embedded components, and more.
We offer single-client consulting on a variety of advanced packaging, materials, equipment, and assembly areas.
TechSearch International president Jan Vardaman served as co-author on a study from IPC that provides a thorough, data-driven analysis of the global semiconductor and advanced packaging ecosystem. The study, An Analysis of the North American Semiconductor and Advanced Packaging Ecosystem, highlights the role of advanced packaging in driving innovation in semiconductor designs.
In partnership with SEMI®, we offer a comprehensive data file tracking over 500 total back-end facilities of IDMs and outsourced semiconductor assembly and testing manufacturers. This database offers access to and insights into global OSAT facilities in China, Taiwan, Korea, Japan, Southeast Asia, Europe, and the Americas. The report also highlights packaging technology offerings by manufacturing location
In partnership with TECHCET and SEMI®, we offer a comprehensive market research study that examines semiconductor packaging trends and their impact on the packaging materials markets. Markets are quantified, new opportunities are highlighted for advanced technology nodes and emerging package form factors, and the materials market outlook is presented.
In partnership with SavanSys Solutions, TechSearch International provides access to valuable cost models for packaging. SavanSys develops the models and we help to calibrate the data. Available are cost models for fan-out wafer level packaging, WLP, 2.5D and 3D packaging, flip chip, and wire bond applications.
TechSearch International's deep understanding of advanced packaging technologies is supported by teardowns of leading-edge system products. We perform our own teardowns and utilize third-party services of other experts. Information from the teardowns can be found throughout our line of reports. We also provide to clients individual teardown reports.