- Nepes FO-WLP process flow
- Side view of InFO PoP and FC PoP
- M-Series FO-WLP
- ECP construction
- PLP structure
- Dedicated 300mm copper pillar capacity
- Solder bump and copper pillar capacity
- Copper pillar 300mm wafer demand
- Flip chip for MR head in HDD
- Cu pillar in TSMC’s InFO
- Qualcomm MDM9645M with flip chip modem
- Silicon photonics IC with flip chip
- AMD’s Fiji with silicon interposer and HBM
- Self-aligned photonic flip chip assembly
Multi-client Reports
2017 Flip Chip and WLP
Market Forecasts and Technology Analysis
Driven by demand for thin, low-profile packages in smartphones, tablets, and wearable devices such as smart watches, fitness bands, and virtual reality headsets, fan-in WLPs are projected to have a >10% growth rate from 2015 to 2020.
FO-WLP shows a staggering growth rate of 82% over the same five-year period. FO-WLP growth is driven by the use in RF, audio CODEC, and power management ICs, and automotive radar, coupled with Apple’s adoption of TSMC’s InFO FO-WLP as the bottom package-on-package (PoP) in the iPhone 7. An update on FO-WLP panel processing and alternatives in the form of flip chip on coreless or thin core substrates is provided.
Driven by small size devices such as filters, low noise amplifiers, power amplifiers, and switches found in smartphones, flip chip growth shows >13% CAGR in unit volume. Flip chip applications, pitch trends, and assembly options are presented and the trends in Cu pillar are analyzed.
The report explores chip package interaction issues and discusses solutions. The 115-page report with full references provides forecasts for the flip chip wafer bumping market by application, device type, number of wafers, and die shipments. Merchant and captive capacity is included.
Forecasts for fan-in WLP, FO-WLP, and flip chip demand are projected in number of die and wafer shipments.
A set of PowerPoint slides accompanies the report.
FO-WLP shows a staggering growth rate of 82% over the same five-year period. FO-WLP growth is driven by the use in RF, audio CODEC, and power management ICs, and automotive radar, coupled with Apple’s adoption of TSMC’s InFO FO-WLP as the bottom package-on-package (PoP) in the iPhone 7. An update on FO-WLP panel processing and alternatives in the form of flip chip on coreless or thin core substrates is provided.
Driven by small size devices such as filters, low noise amplifiers, power amplifiers, and switches found in smartphones, flip chip growth shows >13% CAGR in unit volume. Flip chip applications, pitch trends, and assembly options are presented and the trends in Cu pillar are analyzed.
The report explores chip package interaction issues and discusses solutions. The 115-page report with full references provides forecasts for the flip chip wafer bumping market by application, device type, number of wafers, and die shipments. Merchant and captive capacity is included.
Forecasts for fan-in WLP, FO-WLP, and flip chip demand are projected in number of die and wafer shipments.
A set of PowerPoint slides accompanies the report.
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