2022 Flip Chip and WLP

Trends and Market Forecasts
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TechSearch International’s latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP market growth. The report includes an examination of both fan-in WLP and fan-out WLP markets. The report also examines bump pitch trends and the role of hybrid bonding.

Chiplet architectures are increasingly being adopted to achieve the economic advantages lost with the high cost of silicon scaling on advanced nodes. With chiplet designs, more silicon is needed to support the disaggregation of the monolithic die into smaller intellectual property (IP) building blocks. Many devices have made the conversion from solder bumps to Cu pillar. FO-WLP processes in production using the Deca M-Series™ and TSMC’s InFO use a Cu pillar on the native wafer. Reduced demand for smartphones and PCs this year is changing demand for flip chip packages, but growth will continue. The compound annual growth rate (CAGR) for all types of flip chip devices in units from 2021 to 2026 is 4.5 percent. This includes both solder bump and Cu pillar. Industry-wide capacity utilization was extremely high last year, but has decreased more than 10 percent this year. With continued capacity expansion, utilization will not reach levels seen in 2021 over the next several years.

Despite lower demand for consumer products such as smartphones, Fan-in WLP shipments will increase this year because of continued growth in image sensor demand, particularly for surveillance cameras in China. The WLP count continues to climb for most products. In a few cases, WLP counts have declined in products due to higher levels of integration. The projected CAGR from 2021 to 2026 in units is 7.83 percent. Devices using FO-WLP include application processors, RF, PMICs, audio CODEC, envelope trackers, automotive radar, and some image sensors. Single die are common and multi-die configurations are increasing. A 6.3 percent CAGR in units is projected for 2021 to 2026. Several companies are researching, developing, or installing panel-based production lines. A variety of approaches for large-area production have been developed. No consistent method or panel size has emerged, but several companies have adopted panel sizes of 600 mm x 600 mm. While applications for panels include some portion of the reconstituted wafer market, new applications such as power devices are emerging.

The latest analysis is a 106-page report with full references and an accompanying set of 136 PowerPoint slides.
  • Contents…
    • Executive Summary
      • Flip Chip Developments
      • ​​Flip Chip Supply and Demand
      • Wafer Level Packages
      • Future Growth
    • 1 Technology Developments
      • 1.1 Fan-in and Fan-out WLPs
        • 1.1.1 WLP Reliability
        • 1.1.2 WLP Pitch Trends
      • 1.2 Panel FO-WLP Developments
        • 1.2.1 Amkor Technology
        • 1.2.2 AOI Electronics
        • 1.2.3 ASE Group
        • 1.2.4 Chengdu ESWIN SiP Technology Co.
        • 1.2.5 China Wafer Level CSP
        • 1.2.6 nepes
        • 1.2.7 PEP Innovation
        • 1.2.8 Powertech Technology
        • 1.2.9 Samsung
      • 1.3 Panel Process Challenges
        • 1.3.1 Economics of Panels
        • 1.3.2 Technical Issues
        • 1.3.3 Overcoming Challenges for Panel FO
      • 1.4 Copper Pillar and Microbumps
      • 1.5 Hybrid Bonding
        • 1.5.1 Die-to-Wafer
        • 1.5.2 Wafer-to-Wafer
      • 1.6 Flip Chip Bump Pitch and Substrates
        • 1.6.1 Silicon Interposers
        • 1.6.2 RDL Structures
        • 1.6.3 Embedded Bridge
        • 1.6.4 Build-up Substrates
        • 1.6.5 Glass Core Substrates
        • 1.6.6 FC-CSP Substrate Trends
        • 1.6.7 Leadframe and Molded Substrates
      • 1.7 Underfill Material Trends
      • 1.8 Flip Chip Bump and WLP Price Trends
    • 2 Flip Chip Market Projections
      • 2.1 Wafer Bump Capacity
        • 2.1.1 Flip Chip Bump Capacity
        • 2.1.2 Gold Bump Capacity
      • 2.2 Flip Chip Demand
        • 2.2.1 Flip Chip Bumping Market Projections
        • 2.2.2 Cu Pillar Trends
        • 2.2.3 Gold Bumping Market Projections
        • 2.2.4 Flip Chip Applications by Device Type
          • 2.2.4.1 High-Performance Devices
          • 2.2.4.2 Personal Computers and GPUs
          • 2.2.4.3 Cryptocurrency
          • 2.2.4.4 MediaChips
          • 2.2.4.5 Pre-amps for HDDs
          • 2.2.4.6 Processors for Smartphones
          • 2.2.4.7 RF Modules
          • 2.2.4.8 RF ICs
          • 2.2.4.9 Filters
          • 2.2.4.10 RF Module and Filter Suppliers
          • 2.2.4.11 Medical
          • 2.2.4.12 Automotive Electronics
          • 2.2.4.13 Military, Aerospace, and Satellites
          • 2.2.4.14 DRAM
          • 2.2.4.15 RFID Tags
          • 2.2.4.16 High Brightness LEDs
    • ​​3 WLP Trends and Market Projections
      • 3.1 Fan-in WLP Applications
        • 3.1.1 Mobile Phones
          • 3.1.1.1 WLPs in iPhone 13 Pro
          • 3.1.1.2 WLPs in Google Pixel 6a
          • 3.1.1.3 WLPs in Galaxy S22 Ultra
          • 3.1.1.4 WLPs in Galaxy A53
          • 3.1.1.5 WLPs in Nokia 6300 4G Feature Phone
        • 3.1.2 Tablets
        • 3.1.3 Chromebooks, Laptops, Hybrids
        • 3.1.4 Wearables
          • 3.1.4.1 Smartwatches
          • 3.1.4.2 Smart Earbuds
        • 3.1.5 Smart Speakers
        • 3.1.6 VR, Smart Home, and Dash Cam
        • 3.1.7 Automotive Electronics
        • 3.1.8 Power Devices
      • 3.2 Fan-in WLP Market Forecast
      • 3.3 FO-WLP
        • 3.3.1 FO-WLP Versions
        • 3.3.2 FO-WLP Applications
        • 3.3.3 Future FO-WLP Applications
          • 3.3.3.1 Memory
          • 3.3.3.2 Mobile Application Processors
          • 3.3.3.3 RF mmWave
          • 3.3.3.4 Photonics
        • 3.3.4 FO-WLP on Substrate
          • 3.3.4.1 FO on Substrate with Embedded Bridge
        • 3.3.5 Panel Level FO-WLP Applications
          • 3.3.5.1 PMICs
          • 3.3.5.2 Image Sensors
          • 3.3.5.3 Application Processors
          • 3.3.5.4 SSD Memory PMIC
          • 3.3.5.5 Power Devices
      • ​3.4 FO-WLP Market Forecast
      • 3.5 Fan-in WLP, FO-WLP, Panel Capacity
        • 3.5.1 FO Panel Demand and Capacity
    • 4 Wafer Bumping and WLP Service Providers
    • 5 Flip Chip Assembly and Equipment
      • 5.1 Flip Chip Bonders
      • 5.2 Hybrid Bonders
    • References
  • Figures…
    • Amkor panel process.
    • AOI Electronics FO-WLP cross-section.
    • AMD 3D V-Cache™ using TSMC's SoIC™.
    • IBM Z16 dual chip module on organic substrate.
    • Ponte Vecchio with Foveros and EMIB.
    • Amkor's AoP Technology.
    • Infineon's FO-WLP automotive radar modules.
    • HIFOM for mobile applications.
    • Fan-out for PIC and EIC.
    • AMD's Elevated Fanout Bridge.
  • Tables (partial list)…
    • Flip Chip Demand
    • Flip Chip Capacity
    • Fan-In Wafer Level Package Demand
    • Fan-In WLP Capacity and Demand Projections
    • FO-WLP Forecast
    • FO-WLP Demand in 300mm Equivalent Carriers
    • Annual Panel Capacity
    • Fan-in WLPs with Die Edge Protection
    • FO-WLP Panel Activities
    • Bump Pitch Trends and Substrates
    • Suppliers of Si Interposers
    • Build-up Substrate Features
    • Examples of FC-CSPs
    • Merchant and Captive Flip Chip Bump Capacity
    • Gold Bump Capacity Projections
    • Flip Chip Die Size and Bump Pitch Examples
    • RF Modules with Flip Chip Die
    • Single-Die RF Front-End Devices with Flip Chip
    • RF Transceivers and Radio ICs with Flip Chip
    • WLP Counts in Recent Smartphones
    • Select WLPs in iPhone 13 Pro
    • Select WLPs in Galaxy A53
    • WLPs in Nokia 6300 4G Feature Phone
    • WLPs in Google Pixelbook Go
    • Select WLPs in iPad Pro 11-inch (3rd generation)
    • Select WLPs in Galaxy Watch4 with LTE
    • WLPs in Amazon Echo Dot (4th generation)
    • WLPs in Home Pod mini
    • Select WLPs in Meta Quest 2 VR System
    • WLPs in Samsara Dual-Facing AI Dash Cam
    • FO-WLP Examples
    • Selected Merchant Wafer Bumping and WLP Offerings
    • Reconstituted Wafer and FO-WLP Panel Suppliers
    • R&D and Low-Volume Flip Chip Bonders
    • Pick-and-Place Bonders for FC Mass Reflow, FO-WLP, and Panel
    • Hybrid Bonding Systems
    • Surface Activated Bonding Systems
Stacks Image 26050
brochure
  • Published November 2022
  • 106 pages
  • 10 figures / 64 tables
  • 136 PowerPoint slides
  • $9,000 corporate license
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