TechSearch International gains deep understanding of advanced packaging technologies through a combination of constant close communication with key players in the industry and teardowns of leading-edge system products to examine packaging technologies in mass production. Our teardown research is supported by both internal projects and services provided by third-party experts.

Results from our own teardown projects can be found throughout our Advanced Packaging Update and other reports. We also sell individual teardown reports.

Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
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