TechSearch International gains deep understanding of advanced packaging technologies through a combination of constant close communication with key players in the industry and teardowns of leading-edge system products to examine packaging technologies in mass production. Our teardown research is supported by both internal projects and services provided by third-party experts.

Results from our own teardown projects can be found throughout our Advanced Packaging Update and other reports. We also sell individual teardown reports.

Latest Teardown by TechSearch International

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TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
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