Volume 1-0424

April 2024
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This issue of the Advanced Packaging Update features a detailed financial analysis of the top 20 OSATs. The market forecast for ball grid arrays (BGAs) and chip scale packages (CSPs) is provided in units. Package examples and demand drivers are provided. An update on the market for large body, high-density build-up substrates is provided, including capacity. The CSP market is divided into laminate (FBGA and FLGA) and leadframe (QFN) substrates. Stacked die package trends are included. Unit growth projections for Cu clip and molded interconnect substrates (MIS) are provided. Estimates of the market for each package type are based on input from both captive and merchant assembly operations.
  • Contents…
    •  1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Taiwan's Earthquake
      • 1.3 Semiconductor Industry
    • 2 OSAT Financial Analysis
      • 2.1 Market Overview
      • 2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Technology Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET
        • 2.3.4 Tongfu Microelectronics
        • 2.3.5 Powertech Technology
        • 2.3.6 Tianshui Huatian Technology
        • 2.3.7 UTAC
        • 2.3.8 KYEC
        • 2.3.9 Chipbond
        • 2.3.10 ChipMOS
      • 2.4 OSAT Performance Metrics
        • 2.4.1 Gross Margin
        • 2.4.2 R&D Spending
        • 2.4.3 CAPEX
      • 2.5 Outlook
    • 3 BGA Applications and Markets
      • 3.1 Major Applications for BGA Packages
        • 3.1.1 Personal Computers
        • 3.1.2 Servers, Modeling, and AI
          • 3.1.2.1 Capacity Constraints to AI Growth
            • 3.1.2.1.1 RDL and Bridge Alternatives
        • ​3.1.3 GPUs and Gaming PCs
        • 3.1.4 5G Infrastructure and Networks
        • 3.1.5 Satellites
        • 3.1.6 Automotive
      • 3.2 BGA Market Projections
      • 3.3 Large Body Substrate Supply and Demand
    • 4 CSP Applications and Markets
      • 4.1 Smartphones
        • 4.1.1 Apple iPhone 15 Pro
        • 4.1.2 Samsung Galaxy S23 Ultra
        • 4.1.3 Samsung Galaxy S24 Ultra
        • 4.1.4 Huawei Mate 60 Pro
      • 4.2 Tablets and Laptops
        • 4.2.1 Google Pixel Tablet
        • 4.2.2 Microsoft Surface Pro 9
      • 4.3 AR/VR
        • 4.3.1 Apple Vision Pro
      • 4.4 Smart Home
        • 4.4.1 Amazon Echo Dot (5th generation)
        • 4.4.2 Ecobee Smart Thermostat
        • 4.4.3 August Wi-Fi Smart Lock
        • 4.4.4 Arlo Pro 4 Security Camera
      • 4.5 Wearables
        • 4.5.1 Apple Watch Series 8 (GPS + Cellular)
      • 4.6 Package Trends
        • 4.6.1 WLPs
          • 4.6.1.1 Fan-in WLPs
          • 4.6.1.2 Fan-out WLPs
          • 4.6.1.3 Molded WLPs
          • 4.6.1.4 WLPs with Non-Standard Ball Pitch
        • 4.6.2 QFNs
          • 4.6.2.1 Cu Clip QFN
        • 4.6.3 Molded Interconnect Substrates
        • 4.6.4 Laminate CSPs
          • 4.6.4.1 FBGAs
          • 4.6.4.2 FLGAs
          • 4.6.4.3 Double-Sided FBGAs
        • 4.6.5 Stacked Die CSPs
        • 4.6.6 PoP Developments
      • 4.7 CSP Market Projections
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 3.1 IBM DBHI with and without trench in substrate.
    • 4.1 Apple's A17 in TSMC's InFO PoP.
    • 4.2 Samsung's Exynos 2400 in FO-WLP.
  • Tables…
    • 1.1 End-Product Growth
    • 2.1 Revenue of Top 20 Publicly Traded OSATs
    • 2.2 Currency Impact on Year-over-Year
    • 2.3 Gross Margin for Top 10 OSATs
    • 2.4 R&D Spending for Top 10 OSATs
    • 2.5 CAPEX for Top 10 OSATs
    • 2.6 Historical Top Four OSAT CAPEX Trends
    • 2.7 TSMC Revenue and CAPEX
    • 3.1 Laptop and Desktop CPU Packages
    • 3.2 Server CPU Packages
    • 3.3 AI Packages
    • 3.4 Silicon Interposer Supply and Demand
    • 3.5 GPU and Gaming Processor Packages
    • 3.6 PBGA/LGA Market Projections
    • 3.7 Large Body FC-BGA Substrate Supply and Demand
    • 4.1 Apple iPhone 15 Pro CSPs
    • 4.2 CSP Comparison Between iPhone 14 Pro and iPhone 15 Pro
    • 4.3 Select CSPs in iPhone 15 Pro
    • 4.4 Samsung Galaxy S23 Ultra CSPs
    • 4.5 Galaxy S22 Ultra and S23 Ultra CSP Comparison
    • 4.6 Select CSPs in Galaxy S23 Ultra
    • 4.7 CSP Summary from Samsung Galaxy S24 Ultra Teardown
    • 4.8 CSP Comparison Between Galaxy S24 Ultra and S23 Ultra
    • 4.9 Select CSPs in Galaxy S24 Ultra
    • 4.10 Huawei Mate 60 Pro CSPs
    • 4.11 Mate 30 5G and Mate 60 Pro CSP Comparison
    • 4.12 Select CSPs in Mate 60 Pro
    • 4.13 Select CSPs in Pixel Tablet
    • 4.14 Surface Pro 9 CSPs
    • 4.15 Select CSPs in Surface Pro 9
    • 4.16 Main Chips in Apple Vision Pro’s Main Board Side 1
    • 4.17 Main Chips in Apple Vision Pro’s Main Board Side 2
    • 4.18 Main Chips in Apple Vision Pro’s Charging Board Side 1
    • 4.19 Main Chips in Apple Vision Pro’s Charging Board Side 2
    • 4.20 Main Chips in Apple Vision Pro’s Right Speaker Board
    • 4.21 Sensors in Apple Vision Pro
    • 4.22 Amazon Echo Dot CSP Types
    • 4.23 CSPs in Amazon Echo Dot (5th generation)
    • 4.24 Ecobee Smart Thermostat CSP Types
    • 4.25 CSPs in Ecobee Smart Thermostat
    • 4.26 August Wi-Fi Smart Lock CSP Types
    • 4.27 CSPs in August Wi-Fi Smart Lock
    • 4.28 Arlo Pro 4 Security Camera CSP Types
    • 4.29 Selected CSPs in Arlo Pro 4 Security Camera
    • 4.30 Apple Watch Series 8 CSPs
    • 4.31 Apple Watch 6 and Watch 8 Comparison
    • 4.32 Select CSPs in Apple Watch Series 8 (GPS + Cellular)
    • 4.33 WLPs in Production
    • 4.34 FO-WLP Examples
    • 4.35 Molded FO-WLPs with Edge Protection
    • 4.36 WLPs with Non-Standard Ball Pitch
    • 4.37 QFN Examples
    • 4.38 SON/DFN Examples
    • 4.39 Cu Clip QFN/SON/DFN Examples
    • 4.40 QFN Cu Clip Projections
    • 4.41 MIS Package Examples
    • 4.42 Market Growth for MIS Packages
    • 4.43 FBGA Examples
    • 4.44 FLGA Examples
    • 4.45 Double-Sided FBGA Examples
    • 4.46 Stacked Die CSP Examples
    • 4.47 Recent PoP Examples
    • 4.48 CSP Market Projections

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  • Published April 2024
  • 97 pages
  • 4 figures / 63 tables
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