Volume 4-0126

January 2026
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This issue of the Advanced Packaging Update features a financial analysis of OSATs. Trends in the semiconductor industry with artificial intelligence (AI) data center spending as a driver is presented. A special section is devoted to shortages resulting from AI growth and shifts in allocation of memory capacity. Power delivery challenges and embedded capacitor solutions are presented. An update on developments in co-packaged optics (CPO) and challenges is included.
  • Contents…
    •  1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Semiconductor Sector
    • 2 OSAT Financial Analysis
      • 2.1 Industry Overview
      • 2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET Group
        • 2.3.4 Tongfu Microelectronics
        • 2.3.5 Powertech Technology
        • 2.3.6 Huatian
        • 2.3.7 UTAC
        • 2.3.8 KYEC
        • 2.3.9 Hana Micron
        • 2.3.10 ChipMOS
      • 2.4 Outlook
    • 3 Shortages and Price Hikes
      • 3.1 AI Spending Growth and Concerns
      • 3.2 Memory Shortages
      • 3.3 Assembly Capacity
      • 3.4 Material Shortages
        • 3.4.1 Glass Fabric
        • 3.4.2 RDL Interposers
    • ​4 Power Delivery
      • 4.1 Capacitors and Voltage Regulators
        • 4.1.1 ELSPES
        • 4.1.2 IFS
        • 4.1.3 Murata
        • 4.1.4 Samsung
        • 4.1.5 Saras Micro Devices
        • 4.1.6 TSMC
    • ​5 Co-Packaged Optics Developments
      • 5.1 Company Activities
        • 5.1.1 AMD
        • 5.1.2 Ayar Labs
        • 5.1.3 Broadcom
        • 5.1.4 Celestial AI
        • 5.1.5 IBM
        • 5.1.6 Intel
        • 5.1.7 Lightmatter
        • 5.1.8 Marvell
        • 5.1.9 Nvidia
        • 5.1.10 Nubis
        • 5.1.11 TSMC
      • 5.2 Challenges
        • 5.2.1 Fiber Attach
        • 5.2.2 Lasers
        • 5.2.3 Test
        • 5.2.4 Substrates
        • 5.2.5 Package Assembly
          • 5.2.5.1 Amkor
          • 5.2.5.2 ASE
          • 5.2.5.3 Globalfoundries
          • 5.2.5.4 IBM Bromont
          • 5.2.5.5 Shinko Electric
          • 5.2.5.6 SPIL
    • ​​References
  • Figures…
    • 5.1 OMIB.
    • 5.2 iFAU fiber optical path.
    • 5.3 MCeP® for optics.
  • Tables…
    • 2.1 OSATs Q3 2025 Revenue Growth
    • 2.2 Q3 2025 Revenue Growth for Top 20 OSATs
    • 5.1 NPO and CPO Packages
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  • Published January 2026
  • 40 pages
  • 3 figures / 3 tables
  • 71 PowerPoint slides
  • $8,750 corporate license (4 issues)
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