Volume 2-0722

July 2022
order form
This second volume of the Advanced Packaging Update includes an analysis of OSAT financials, new high-performance package introductions, and trends in co- packaged optics. An updated analysis of the substrate capacity shortage is presented, along with an assessment of the financial health of the industry. TechSearch International’s annual survey on substrate design rules is presented, with special coverage of suppliers of laminate flip chip BGA and CSP substrates worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Growth Slows
        • 1.1.1 U.S. Macroeconomic Trends
      • 1.2 Semiconductor Shortage
        • 1.2.1 Semiconductor Fab Expansion
      • 1.3 Smartphone Market Growth Slows
        • 1.3.1 Samsung Galaxy S22 Ultra Packages
        • 1.3.2 Samsung Galaxy A53 5G Packages
    • ​2 OSAT Financial Analysis
      • 2.1 Market Overview
      • ​2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 Powertech Technology
        • 2.3.4 JCET Group
        • 2.3.5 Tongfu Microelectronics
        • 2.3.6 Huatian
        • 2.3.7 KYEC
        • 2.3.8 UTAC
        • 2.3.9 ChipMOS
        • 2.3.10 Chipbond
      • 2.4 Outlook
    • 3 Advanced Packaging Developments
      • 3.1 Silicon Interposers
      • 3.2 RDL Structures
        • 3.2.1 CoWoS with Organics
        • 3.2.2 RDL on Laminate Substrates
        • 3.2.3 New High-Density Fan-Out
          • 3.2.3.1 TSMC's InFO for Mobile Expands
          • 3.2.3.2 Fan-out on Substrate
      • 3.3 3D Wafer-to-Wafer Hybrid Bonding
    • 4 Trends in Integrated Optics
      • 4.1 CPO Drivers
      • 4.2 Integrated Photonics Developments
        • 4.2.1 Ayar Labs
        • 4.2.2 Broadcom
        • 4.2.3 Cisco
        • 4.2.4 GLOBALFOUNDRIES
        • 4.2.5 Intel
        • 4.2.6 Rain Tree Photonics and IME A*STAR
        • 4.2.7 Rockley Photonics
        • 4.2.8 OSATs
          • 4.2.8.1 Amkor Technology
          • 4.2.8.2 ASE
          • 4.2.8.3 IBM Bromont Assembly and Test
      • ​4.3 Package Trends
        • 4.3.1 Assembly Issues
        • 4.3.2 Standards and Design Activities
    • ​5 Substrate Industry Capacity
      • 5.1 FC-CSP Capacity
      • 5.2 FC-BGA Supply and Demand
    • 6 Substrate Design Rules
      • 6.1 Today's Laminate Feature Size
      • 6.2 Company Design Rules
        • 6.2.1 ACCESS Semiconductor Co.
        • 6.2.2 ASE Materials
        • 6.2.3 AT&S
        • 6.2.4 Daeduck
        • 6.2.5 Daisho Denshi Co.
        • 6.2.6 Fujitsu Interconnect Technologies
        • 6.2.7 Haesung DS Co.
        • 6.2.8 Ibiden Co.
        • 6.2.9 Kinsus Interconnect Technology
        • 6.2.10 Korea Circuit Company
        • 6.2.11 Kyocera International
        • 6.2.12 LG Innotek
        • 6.2.13 Nan Ya PCB Corp.
        • 6.2.14 Samsung Electro-Mechanics
        • 6.2.15 Shennan Circuits Co.
        • 6.2.16 Shinko Electric Industries Co.
        • 6.2.17 Simmtech Co.
        • 6.2.18 Toppan Printing Co.
        • 6.2.19 TTM Technologies
        • 6.2.20 Unimicron Technology Corp.
    • Appendix: Substrate Suppliers
    • References 
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 3.1 AMD's Elevated Fanout Bridge.
    • 4.1 ASIC to optics signal degradation in data center.
    • 4.2 Broadcom co-packaged SCIP and ASIC.
    • 4.3 CoCoS.
    • 4.4 Fan-out for PIC and EIC.
    • 4.5 CPO Solution implemented with Rockley's Optical Engines.
  • Tables…
    • 1.1 Package Counts in Recent Samsung Galaxy S Series Phones
    • 1.2 Samsung Galaxy S22 Ultra Packages
    • 1.3 CSP Comparison Between Galaxy S22 Ultra and S21 Ultra
    • 1.4 Samsung Galaxy A53 5G Packages
    • 2.1 Top 20 OSATs Quarterly Revenue
    • 5.1 Selected Substrate Makers’ Gross Margin
    • 5.2 Body Size and Layer Counts
    • 5.3 FC-BGA Substrate Supply and Demand
    • 5.4 FC-BGA Demand with Smaller Server Substrate Size
    • 6.1 Build-up Substrate Features
    • 6.2 Selected Build-up FC-PBGA Substrate Suppliers
    • 6.3 Selected Build-up FC-CSP Substrate Suppliers
    • 6.4 Design Rules for ACCESS FC-BGA Substrates
    • 6.5 Design Rules for ACCESS Coreless Substrates
    • 6.6 Design Rules for ACCESS FC-CSP Substrates
    • 6.7 Design Rules for ACCESS Wire Bond CSP Substrates
    • 6.8 Design Rules for ASE PBGA/CSP Substrates
    • 6.9 Design Rules for AT&S FC-PBGA Substrates
    • 6.10 Design Rules for Daeduck FC-CSP Substrates
    • 6.11 Design Rules for Daeduck Thin Build-Up WB Substrates
    • 6.12 Design Rules for Daeduck FC-PBGA Substrates
    • 6.13 Design Rules for Daisho Denshi PBGA/CSP Substrates
    • 6.14 Design Rules for FICT FC-PBGA Substrates
    • 6.15 Design Rules for Ibiden FC-PBGA Substrates
    • 6.16 Design Rules for Ibiden Coreless Substrates
    • 6.17 Design Rules for Kinsus FC-PBGA Substrates
    • 6.18 Design Rules for Kinsus FC-CSP Substrates
    • 6.19 Design Rules for Kinsus PBGA/CSP Substrates
    • 6.20 Design Rules for Kinsus Coreless Substrates
    • 6.21 Design Rules for KCC FC-CSP Substrates
    • 6.22 Design Rules for KCC UT-CSP Substrates
    • 6.23 Design Rules for Kyocera FC-PBGA Substrates
    • 6.24 Design Rules for Kyocera FC-CSP Substrates
    • 6.25 Design Rules for Kyocera Coreless Substrates
    • 6.26 Design Rules for LG Innotek CSP Substrates
    • 6.27 Design Rules for LG Innotek FC-CSP Substrates
    • 6.28 Design Rules for Nan Ya PCB FC-PBGA Substrates
    • 6.29 Design Rules for Nan Ya PCB PBGA/CSP Substrates
    • 6.30 Design Rules for Nan Ya FC-CSP Substrates
    • 6.31 Design Rules for Nan Ya PCB FC-PBGA Coreless Substrates
    • 6.32 Design Rules for SEMCO FC-PBGA Substrates
    • 6.33 Design Rules for SEMCO PBGA/CSP Substrates
    • 6.34 Design Rules for SEMCO FC-CSP Substrates
    • 6.35 Design Rules for SCC PBGA/CSP Substrates
    • 6.36 Design Rules for Shinko Electric FC-PBGA Substrates
    • 6.37 Design Rules for Shinko Electric FC-CSP Substrates
    • 6.38 Design Rules for Shinko Electric Coreless Substrates
    • 6.39 Design Rules for Simmtech PBGA/CSP Substrates
    • 6.40 Design Rules for Simmtech Coreless Substrates
    • 6.41 Design Rules for Toppan FC-PBGA Substrates
    • 6.42 Design Rules for CoreEZ® Substrates
    • 6.43 Design Rules for HyperBGA® Substrate
    • 6.44 Design Rules for PBGA Substrates
    • 6.45 Design Rules for MicroFlex (Polyimide)
    • 6.46 Design Rules for Unimicron FC-PBGA Substrates
    • 6.47 Design Rules for Unimicron FC-CSP Substrates
    • 6.48 Design Rules for Unimicron PBGA/CSP Substrates

Brochure Coming Soon

  • Published July 2022
  • 89 pages
  • 7 figures / 57 tables
  • 43 PowerPoint slides
  • $5,100 annual subscription (4 issues)
    $2,500 single issue
    $8,750 corporate license
Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
Network
Contact
  • email message
  • +1.512.372.8887
  • +1.512.372.8889
  • 4801 Spicewood Springs Rd, Ste 150
    Austin, TX 78759
    United States