TechSearch International, Inc. was founded in Austin, Texas, in 1987 by E. Jan Vardaman as a technology licensing and consulting firm specializing in the electronics industry.
We are recognized around the world as a leading consulting company in the field of advanced semiconductor packaging technology.
TechSearch International, Inc.
4801 Spicewood Springs Rd.
Austin, Texas 78759 USA
Participate directly with client teams in providing an understanding of changes and drivers in the marketplace.
Provide competitive analysis of semiconductor packages, materials, equipment, and assembly marketplaces to aid new product introductions.
She is the editor of Surface Mount Technology: Recent Japanese Developments, co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbun), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia and on the US mission to study manufacturing in China. She is a member of IEEE EPS, IMAPS, SMTA, and SEMI. She was elected to two terms on the IEEE EPS Board of Governors. She received her BA in Economics and Business from Mercer University in Macon, Georgia in 1979 and her MA in Economics from the University of Texas at Austin in 1981. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
He specializes in electronic materials and advanced packaging. Before becoming a consultant, Dr. Bachner was the Director, Advanced Product Programs at Alcoa Electronic Packaging, Inc., a manufacturer of ceramic pin grid arrays for microprocessor application. Before joining Alcoa, he worked in marketing and product development related to advanced packaging at Ceramics Process Systems and Engelhard Corporation. Dr. Bachner received his BS and Ph.D. degrees from the Massachusetts Institute of Technology in Cambridge, Massachusetts (MIT). Following receipt of his doctorate, he was responsible for research programs in silicon device technology, thin films, and advanced packaging at the MIT Lincoln Laboratory. He is a member of IEEE EPS and IMAPS.
She has more than 25 years experience in the design, test, and manufacturing of electronic packaging for semiconductors and systems from positions with Freescale, Motorola, Microelectronics and Computer Technology Corporation (MCC) and Eastman Kodak authoring/co-authoring numerous publications. She is a member of IEEE, JEDEC, and IMAPS. A member of the IMAPS technical committee since 2007, her contributions include chairing the FC/WLP Track for the DPC in 2013 and 2014, co-chairing the FC track in 2009 & 2010, and moderating Technical Panel Discussions in 2011 and 2012. She received her BS degree in Electrical Engineering degree from Purdue University.
She is the former marketing manager for IBM Interconnect Products Group and the former Director of Marketing for Endicott Interconnect Technologies. During her 21-year career at IBM, she held positions in engineering, finance, strategic planning, and marketing management, spanning the areas of chip packaging, printed circuit boards, and electronic assembly. She is a member of the IPC and serves on its Technology Marketing Research Council steering committee. She received the IPC President’s Award and was nominated as one of the Atomic 29 most influential people in the IMS/PCB industry. She received her BS in chemistry from State University of New York and received her marketing education through IBM’s professional development programs. She has several technical and business publications, holds several US patents related to the electronic packaging industry, and is the author of a quarterly column, Marketing Matters, for Circuitree magazine.
He was a Distinguished Member of Technical Staff in the IC Packaging and Interconnection Organization at Agere Systems. He held positions with AT&T/Lucent/Agere for 23 years and was the lead resource on PCB technology supporting the development of advanced organic PBGA substrates for wire bonded and flip chip IC interconnections. He maintained close relationships with a broad spectrum of organic substrate suppliers worldwide and continually assessed the latest technologies and manufacturing capabilities. Before joining AT&T, he was an engineering specialist at the Singer/Kearfott Company, involved in electronic packaging and thermal design of airborne electronic modules and inertial navigation systems for the military. He has authored chapters in several McGraw Hill IC Packaging Handbooks, co-edited a McGraw Hill book titled Failure-Free IC Packages, and conducted many seminars and presented numerous papers on electronic packaging. He holds eight US patents and three patents pending on IC packaging construction and thermal enhancements. He holds BS, MS, and ME degrees in mechanical engineering from Columbia University in New York, New York and has a New Jersey Professional Engineering License.
He earned his BS degrees in Physics and Mathematics from Wheeling College, West Virginia in 1974, his MS degree in Solid State Physics from DePaul University in 1978, and his Ph.D. in Electrical Engineering from the University of Arkansas in 1996. He spent 15 years at IBM, first as development manager of microelectronics and manufacturing engineering manager, then as the director of manufacturing engineering, R&D and sales and marketing at Sheldahl. He pioneered the development of a low-cost/high-performance integrated passive packaging technology that incorporates multilayered flex material with capacitor, resistor and inductor devices embedded in the electronic package. He is a Senior Member of IEEE EPS and a member of IMAPS and the New York Academy of Science. He is also an Adjunct Faculty member in the Department of Electrical Engineering at the University of Arkansas, and has published over 70 papers in journals and technical conference proceedings.
She obtained her BS and MS degrees in Materials Science and Engineering from the Massachusetts Institute of Technology in 1985 and 1986, respectively. She spent seven years as a development engineer at the IBM Watson Research Center in New York. In 1993 she joined Tessera, Inc. and moved to California, where she was responsible first for development, and later for Technical Marketing of the µBGA. She subsequently worked at nCHIP and at LSI Logic as a Product Marketing Manager for packaging. Linda has several publications and is named on seven US and four foreign patents. She has served as president of the local IEEE EPS chapter, and also on the committee of the International Electronics Manufacturing Technology (IEMT) symposium for four years.
He has more than 25 years experience analyzing and predicting semiconductor market and technology trends. Before joining TechSearch in 2015, he was vice president and co-founder of IC Insights, responsible for the company’s research analysis of chip fabrication and packaging technology advancements. He also developed market forecasts using both supply-side and demand-side research, including analysis of wafer fab capacity levels, R&D spending, IC manufacturing costs, and end-use system requirements. He received his BS degree in Electrical Engineering from Arizona State University and he is a member of IEEE's EPS, CAS, and SSC societies, IMAPS, and SMTA.