TechSearch International collaborates with several industry leaders that offer reports and services complementary to ours. We work with these partners to jointly develop products that draw upon the strengths and resources of both parties. For example, we team up with SEMI® to produce a comprehensive biennial report on the semiconductor packaging materials market.

Partnership reports and services:

  • Worldwide OSAT Manufacturing Sites Database – SEMI®
    order form
    Stacks Image 35644
    brochure
    visit SEMI®
    • Published July 2017
    • call for pricing
    The Worldwide OSAT Manufacturing Sites Database is a comprehensive report covering worldwide facilities that provide outsourced semiconductor assembly and testing manufacturing services. This database offers access and insights into global OSAT facilities in China, Taiwan, Korea, Japan, Southeast Asia, Europe, and the Americas. The report also highlights new and emerging package offerings by manufacturing location.

    Specific details tracked include:
    • Plant site technology capability: Tape and Reel, Test
    • Packaging assembly service offered: BGA, specific leadframe type such as QFP, QFN, SO, flip chip bumping, WLP, Modules/SIP, etc.

    The Worldwide OSAT Manufacturing Sites Database is an essential business tool for anyone interested in the device packaging arena. Packaging technology directly affects performance, reliability and cost of semiconductors. Tracking advancements in packaging technology requires understanding the offerings by companies in each location.

    Features

    • Company information and manufacturing sites, including headquarter and regional facility information, ownership and partnership status
    • Plant site with approximate plant area
    • Device technology capability available
    • Plant site technology capabilities
    • Assembly services offered
    • Industry analyst comments

    Methodology

    The source of information for this study is based on both primary and secondary research. The primary research includes in-person interviews and surveys with industry contacts from nearly 100 OSAT facilities worldwide.
  • Global Semiconductor Packaging Materials Outlook – SEMI®
    order form
    Stacks Image 25473
    brochure
    visit SEMI®
    • Published April 2018
    • SEMI Members:
      $5,000 single user
      $12,500 multi-user
      Non-Members:
      $6,000 single user
      $15,000 multi-user
    SEMI and TechSearch International, Inc. have cooperated in the development of the eighth edition of the Global Semiconductor Packaging Materials Outlook, a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. Interviews were conducted with more than 130 semiconductor manufacturers, packaging subcontractors, fabless semiconductor companies, and packaging materials suppliers to gather information for this report.

    The following semiconductor packaging materials segments are covered:
    • Substrates
    • Leadframes
    • Bonding wire
    • Mold compounds
    • Underfill materials
    • Liquid encapsulants
    • Die attach
    • Solder balls
    • Wafer level package dielectrics
    • Wafer level plating chemicals

    Packaging materials markets are quantified; new opportunities are highlighted for advanced technology nodes and emerging package form factors, and forecasts through 2021 are presented.

    Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly affect the performance, reliability, and cost of semiconductors, and offer significant improvement potential.

    Features

    • Concise executive summary
    • Technology trends
    • Regional market size
    • Five-year market forecast
    • Supplier market share
    • Market size in revenue and units
    • Capacity and utilization trends
    • Excel workbook file summarizing market information
  • Cost Models – SavanSys Solutions
    Fan-out Wafer Level Packaging Cost Analysis
    order form
    Stacks Image 35676
    brochure
    visit SavanSys
    • Published Q4 2016
    • $3,995 single license
      $7,000 corporate license
    Wafer level packaging (WLP) is often the most cost-effective approach for achieving miniaturization. However, using wafer level packaging for the wrong applications can be needlessly expensive. The significant differences between printed circuit board interconnect design rules and semiconductor interconnect design rules must be resolved by the package, and this presents unique challenges for wafer level packaging.

    If miniaturization is not required, a wire bond package is usually the most cost-effective packaging approach. However, a modified wafer level packaging approach called fan-out wafer level packaging is one option that overcomes the traditional WLP I/O restrictions. In many cases, fan-out wafer level packaging or flip chip packaging is the lowest cost solution for applications requiring a moderate number of I/Os with some package size constraints.

    This paper compares the total packaging cost of the following four technologies:

    • Wire bond packaging
    • Flip chip packaging
    • Fan-in wafer level packaging
    • Fan-out wafer level packaging

    The analysis is accomplished using a comprehensive activity based cost model for each of the four package technologies. All wafer preparation activities (bumping for flip chip, wafer mounting, backgrind, dicing, etc.), fabrication activities (redistribution layer creation, inner layer processing, build-up layer processing, drilling, surface finish, testing, singulation, etc.), and assembly activities (die bonding, wire bonding, underfill, mold compound, lid attach, solder ball attach, etc.) are modeled and verified using multiple industry sources.

    2.5D & 3D Cost Model
    order form
    Stacks Image 25525
    brochure
    visit SavanSys
    • $12,500 corporate license
      (annual fee)
    After successful collaboration on cost models for Wafer Level Packaging, Flip Chip, Wire Bond, and other technologies, SavanSys Solutions and TechSearch International released a cost trade-off model for 2.5D and 3D packaging technologies. While there are still technical barriers to high volume adoption of 2.5D and 3D packaging solutions, cost remains a primary obstacle. The question is not whether 2.5D and 3D stacks can be built, but rather which applications are appropriate for these technologies based on cost/performance.

    The 2.5D & 3D Packaging Cost Model covers the total cost and yield from fabrication of the wafer to complete assembly, for both 2.5D and 3D applications. The user is able to edit a variety of parameters, including TSV and interposer characteristics, supplier specific inputs, and die preparation details. For parameters not known or specified, the model will estimate it based on other user entries and the latest industry knowledge. A detailed cost break down of the total process cost is generated for each analysis, allowing the user to pinpoint the exact steps in the process flow that contribute to cost. In addition, detailed manipulation of the process flow is available, allowing the user to disable or enter specific values for process steps.

    • SavanSys develops the model software
    • TechSearch helps with model calibration

    WLP, Flip Chip, Wirebond Cost Models
    order form
    Stacks Image 25577
    brochure
    visit SavanSys
    • WLP
    • Flip Chip
    • Wire Bond
    • Price per model (Flip Chip, Wire Bond, or WLP):
      $5,750 single user
      (annual fee)
      $12,500 corporate license
      (annual fee)
    Wafer level packaging (WLP) is often the most cost-effective approach for achieving miniaturization. However, using wafer level packaging for the wrong applications can be needlessly expensive. The significant differences between printed circuit board interconnect design rules and semiconductor interconnect design rules must be resolved by the package, and this presents unique challenges for wafer level packaging.

    If miniaturization is not required, a wire bond package is usually the most cost-effective packaging approach. However, a modified wafer level packaging approach called fan-out wafer level packaging is one option that overcomes the traditional WLP I/O restriction. In many cases, fan-out wafer level packaging or flip chip packaging is the lowest cost solution for applications requiring a moderate number of I/Os with some package size constraints.

    This paper compares the total packaging cost of the following four technologies:

    • Fan-in wafer level packaging
    • Fan-out wafer level packaging
    • Flip chip packaging
    • Wire bond packaging

    The analysis is accomplished using a comprehensive activity based cost model for each of the four package technologies. All wafer preparation activities (bumping for flip chip, wafer mounting, backgrind, dicing, etc.), fabrication activities (redistribution layer creation, inner layer processing, build-up layer processing, drilling, surface finish, testing, singulation, etc.), and assembly activities (die bonding, wire bonding, underfill, mold compound, lid attach, solder ball attach, etc.) are modeled and verified using multiple industry sources.

    • SavanSys develops the model software
    • TechSearch helps with model calibration
  • System Teardown Reports – TPSS Group
    Stacks Image 35725
    Stacks Image 35732
    • pricing varies (see list below or contact us)
    Total Process Solution Study Group (TPSS) was started in mid-2003 by engineers in Japan involved in the assembly and Jisso technology for advanced portable equipment such as cellular phones and digital still cameras. Today, TPSS provides technology and detailed teardowns of smartphones, tablets, wearables, game consoles, drones, and more. The analysis is provided electronically as a PowerPoint presentation. The reports are marketed by TechSearch International, Inc.

    The reports typically contain details such as:
    • Photographs of circuit boards and components
    • Component information such as vendor, type of package, size, lead count, pitch
    • X-ray images of packages
    • Detailed analysis of displays and camera modules
    • Printed circuit board (PCB) construction information

    Contact us to discuss the content of these reports or to see a sample.


    Recent teardowns:
    August 2018

    • Vivo NEX, 33 packages (PoP with MCeP for bottom package, FBGAs, CLGAs, FLGAs, QFNs, SON, WLPs), includes details of display (OLED), bezel-less display, camera modules, and fingerprint sensor, $480 (115 slides).

    • Xiaomi Mi 8, 39 packages (PoP with MCeP, CLGA, FLGAs, FBGAs, QFN, SON, WLPs), includes details of facial recognition, fingerprint sensor, shows NAND flash with flip chip controller, $480 (111 slides).

    • Xiaomi Mi Mix 2s, 45 packages (PoP with MCeP for bottom package, FBGAs, CLGAs, FLGAs, QFNs, SONs, WLPs), includes details of bezel-less display, camera modules, and fingerprint sensor, $480 (134 slides).

    July 2018

    • LG V30+, 39 packages (PoP with MCeP for bottom package, FBGAs, CLGAs, FLGAs, QFNs, WLPs), includes details of display (OLED), heat pipe, camera modules, and fingerprint sensor, $460 (116 slides).

    • Vivo X21 UD, 30 packages (CLGA, FLGAs, FBGAs, QFNs, SON, WLPs), includes details of display (Bezel-less), fingerprint sensors, shows main board and sub-board, $450 (100 slides).

    • Huawei P20 Pro, 45 packages (PoP with MCeP for bottom package, FBGAs, CLGAs, FLGAs, QFNs, SONs, WLPs), includes details of camera modules, fingerprint sensor, shows main board and sub-board, $460 (114 slides).

    • AI Speakers: Amazon Alexa - 10 packages (QFNs, FBGAs, CLGAs); Google Home - 9 packages (FBGAs, WGN, TSOP, SSOP); LINE Clova WAVE - 26 packages (QFNs, DFNs, FBGAs, WLPs, CLGA, TO, SSOP); SONY LF-S50G - 7 packages (QFNs, FBGAs, CLGA, BOC, TSOP); Google Home mini - 2 packages (QFN, SOP); ONKYO Smart Sp G3 - 12 packages (QFNs, FBGAs, CLGAs, SOPs), $350 (113 slides).

    • Amazon Echo Show, 21 packages (CLGAs, FLGAs, FCBGAs, SON, QFNs), includes details of metal shielding and touch screen panel, $380 (83 slides).

    May 2018

    • Samsung Galaxy S9, 48 packages (FLGAs, PoP, FBGAs, CLGAs, QFN, SOs, SON, WLPs), includes details of display, camera modules, and antenna, Price $480 (135 slides).

    • Samsung Galaxy S9+, 48 packages (FLGAs, FBGAs, SONs, QFN, SOs, CLGA, WLPs), includes details of camera modules and fingerprint sensor, Price $500 (125 slides).

    • B&S Partners AzICHI PVR-40 Portable Video Player, 5 packages (SOPs, QFP, QFNs), Price $80 (10 slides).

    • COWON AQ2 Video Event Data Recorder, 13 packages (SOPs, QFNs, LGAs), includes camera module, Price $130 (18 slides).

    • Mothertool MT-EN1S Sound Level Meter, 4 packages (SOPs, COB), Price $80 (10 slides).

    March 2018

    • Casio Digital Camera GZE-1, GEC-10 (Controller with LCD) & GEC-1 (Remote Controller), 23 packages (FBGAs, FLGAs, CBGA, QFNs, WLPs, plus MCM Bluetooth module), Price $230, (38 slides).

    January 2018

    • Samsung Galaxy Note 8, 41 packages (FBGAs, FLGAs, CLGAs, QFN, SONs, CBGA, WLPs, including PoP), details of display, camera modules, iris scan, and S-pen, Price $450 (103 slides).

    December 2017

    • Apple iPhone X, 47 packages (FLGAs, FBGAs, CLGAs, QFNs, FO-WLP, WLPs, including PoP), details of OLED and flex for AMOLED panel, camera modules, facial recognition, and discussion of use of LCP, Price $550 (161 slides).

    • DJI Phantom 4 Advanced Drone, 55 packages (FLGAs, BGAs, QFNs, SOPs, QFPs, SONs, and WLP), details of boards and sub-boards, Price $380 (88 slides).

    October 2017

    • Apple iPhone 8 Plus, 62 main board packages (FBGAs, FLGAs, CLGAs, WLPs including InFO Fan-out WLP PoP), details of display, LED backlight, 3D touch sensor, camera modules, and wireless charging, Price $500 (116 slides).

    • Sony Xperia XZ Premium (DOCOMO SO-04), 38 main board packages (FBGAs, FLGAs, CLGAs, QQFN, SONs, WLPs, includes PoP), details of display, Sony’s stacked image sensor, camera modules, new antenna, and EMI shielding, Price $500, (123 slides).

    July 2017

    • Samsung Galaxy S8 (au SCV36), 48 packages including MCeP PoP (FLGAs, FBGAs, CLGAs, SON, COF, WLPs), details camera modules, fingerprint sensor, iris recognition sensors, OLED, and heat path, Price $520 (164 slides).

    • Sony Xperia XZ, 37 packages including MCeP PoP (FLGAs, FBGAs, CLGAs, SON, QFNs, WLPs), details camera modules, fingerprint sensor, display and FPC assembly, Price $400 (99 slides).

    • Xiaomi Mi6, 35 packages including MCeP PoP (FLGAs, FBGAs, CLGAs, SON, QFNs, WLPs, and FO-WLP) details camera modules, fingerprint sensor, and Snapdragon heat path, Price $480 (124 slides).

    • Nintendo Switch, 38 packages (FLGAs, FBGAs, QFNs, DFNs, SONs, SOP, WLPs), details LCD, Joy controllers, console memory card, Price $280 (66 slides).

    • Lenovo YOGA 910, 28 packages including (BGAs, FBGAs, FLGA, QFNs, DFNs, QFP, COF, and WLPs), details SSD and WiFi modules, fingerprint sensor, heat sink and cooling fan, LCD display touch screen and LCD driver module, and camera module, Price $250 (39 slides).

    May/June 2017

    • Xiaomi Mi5s, 36 packages (CLGAs, FLGAs, FBGAs including PoP, QFNs, SONs, SO, WLPs, FO-WLP, details EMI shielding, display, and fingerprint sensor, Price $400 (82 slides).

    • ZTE AXON mini, 20 packages (LGAs, FBGAs, QFNs, WLPs), Price $170 (27 slides).

    • Samsung Galaxy S8+, 52 packages (FLGAs, CLGAs, CBGA, FBGAs, SONs, WLPs, includes one PoP), Details of OLED display, camera module, fingerprint sensors and Iris authentication, processor comparison, Price $520 (160 slides).

    • CASIO Outdoor Smart Watch WSD-F10, 10 packages (DFN, FBGAs including PoP, LGA, CLGA, WLPs), Price $150 (17 slides).

    • SunnyCam HD Video Recording Glasses Xtream SCXTR0201, 3 packages on main board (FBGAs, LGA) plus socket and surface mount packages, Price $170 (20 slides).

    • Three 16GB USB Memory – ELECOM USB MF-AU3A16GSV, Princeton Xiao USB PFU-XJ3S/16GK and SONY Pocketbit USM16X L, each memory card contains a TSOP and either a QFP or QFN, Price $130 (13 slides).

    • Mouse Computer Laptop WN891, 9 packages (DFN, QFNs, FBGAs, LGAs), details of keyboard and touchpad, Price $150 (25 slides).

    April 2017

    • Meizu Smartphone, Meilan M3s (Y685Q) Dual SIM TD-LTE 32GB, 15 packages (SOP, DFN, QFNs, FGBAs, LGAs, WLP), including details of home button, camera module, and touch panel, Price $150 (28 slides).

    • Huawei Ascend Mate 9, 50 packages (SONs, QFNs, FLGAs, CLGAs, PoP, WLPs) includes details of EMI shielding, fingerprint sensor, and camera module, Price $400 (101 slides).

    • Xiaomi Mi Mix, 38 packages (SONs, QFNs, CLGAs, FLGAs, PoP, FBGAs, WLPs, FO-WLP), include details of panel speakers, EMI shield, display, and camera modules, Price $400 (110 slides).

    • GolfNavi - Yupiteru YGN4100Upitel and GreenOn The Golf Watch Premium G011M, 7 packages (DFN, QFPs, LGAs, WLP), Price $150 (37 slides).

    March 2017

    • Fujitsu Arrows M2, 20 packages (QFNs, FBGAs, FLGAs, WLPs), includes details of camera module, Price $200 (24 slides).

    • ASUS Zenfone Zoom, 24 packages (SOP, SON, DFNs, QFNs, FLGAs, FBGAs, WLPs), includes details of camera module, Price $200 (34 slides).

    • Apple Watch Series 2, general construction of watch without package details, Price $250 (26 slides).

    • Bragi Wireless Earphone, The Dash, 14 packages (DFN, QFNs, SOP, FLGAs, FBGAs, WLPs), Price $150 (17 slides).

    January 2017

    • Huawei Smartphones, Huawei P9 Plus, 50 packages (QFNs, SONs, FLGAs, CLGAs, FBGAs, WLPs, plus PoP) includes details of dual camera with auto focus, display, and EMI shielding, and Huawei Honor V8, view of 32 packages on main board (QFNs, SON, CLGAs, FLGAs, FBGAs), $400 (89 slides).

    • Oppo Smartphones, Oppo R9, 29 packages (QFNs, SON, FLGAs, FBGAs, CLGAs, WLPs) including details of camera modules and Oppo R9s, view of 16 packages on main board (QFNs, FBGAs, CLGA, WLPs, FO-WLPs,) including details of camera modules, $400 (97 slides).

    • Vivo Smartphones, Vivo X7 Plus, 30 packages (QFNs, FLGAs, FBGAs, CLGAs, WLPs, FO-WLPs, PoP) including camera module details and Vivo X9, view of 18 packages on main board (QFNs, FLGAs, FBGAs, CLGAs, WLPs, and FO-WLPs) including details of camera module and OLED display, $400 (103 slides).

    December 2016

    • Apple iPhone 7 Plus, 54 packages (CLGAs, FLGAs, SO, SON, FBGAs, PoP including TSMC’s InFO for the bottom PoP, WLPs, and COF) plus details of display, camera modules, fingerprint sensor, taptic engine (home button), EMI shielding, and thermal management, Price $550 (175 slides).

    • Smart Watches: Sony wena 10 packages (DFN, QFN, SOP, CLGAs, MLGA, FBGA, LGA, WLPs. FBGA, LGA) and Samsung Gear 2 16 packages (LGAs, PoP, DFNs, FBGA, module, MCM, and WLPs), Price $250 (40 slides).

    • Comparison of Five portable SSDs, Transcend 2.5” SSD 370S 5 packages (DFNs and FBGAs including stacked die), ADATA Premier Pro SP920 7 packages (FBGAs, DFNs, QFN), Samsung SSD 850 EVO (3D V-NAND) 6 packages (FBGAs, DFNs, FC-QFN), Samsung SSD 750 EVO 5 packages (FBGAs, DFNs, FC-QFN) and SanDisk Ultra II SDSSDH II STAT2.5 5 packages (FBGAs, COB, QFN, DFN), Price $280 (53 slides).

    • Microsoft Surface Pro 4, 50 packages (DFNs, QFNs, SMDs, FBGAs, TSSOP, SONs, PowerPAK), plus details of thermal management, display panel, camera modules, keyboard, Price $280 (75 slides).

    July/August 2016

    • Huawei P9 Plus, co-designed with Leica and referred to as a "camera with smartphone features," 50 packages (including PoP, WLPs, FLGAs, FBGAs, QFNs, CLGAs, SONs), details of camera module including dual lens camera, fingerprint sensor module description, thermal management explanation with outline of thermal path, information on display, Price $500 (117 slides).

    • Xiaomi Mi5 Standard, 36 packages on main board (PoP, QFNs, SONs, SO, FBGAs, FLGAs, CLGAs, WLPs, FO-WLP, details of camera modules, display, fingerprint sensor module, connectors, and thermal management including thermal interface materials, Price $500 (113 slides).

    • Xiaomi Mi MAX, 28 packages on main board (SO, SONs, QFNs, PoP, FBGAs, FLGAs, CLGAs, WLPs, FO-WLPs, details of display, camera modules, fingerprint sensor module, and thermal management, Price $480 (84 slides).

    • Wireless LAN Routers (ELECOM WRC-1167GHBK3-A, NEC PA-WF1200HP2 and BUFFALO WHR-1166DHP2), ELECOM WRC-1167GHBK3-A: 9 packages (SOPs, QFPs, QFNs, FBGA), NEC PA-WF1200HP2: 9 packages (QFNs, DFNs, SOP, FBGA, BGA), BUFFALO WHR-1166DHP2: 7 packages (SOPs, QFNs, FBGAs), all show antenna and PCB, Price $250 (32 slides).

    April/May 2016

    • Samsung Galaxy S7 Edge, 41 packages on mainboard (FBGAs, FLGAs, CLGAs, QFNs, SONs, SOs, WLPs, FO-WLPs, including PoP), details of OLED, descriptions of sensors including fingerprint sensor details, shows heatpipe for cooling application processor, Price $500 (115 slides).

    • Microsoft Lumia 640XL, 17 packages on mainboard (FBGAs, FLGAs, QFNs, and WLPs), details of camera modules, Price $250 (29 slides).

    • UPQ Phone A01X, 15 packages on mainboard (FBGAs, FLGAs, QFNs, DFN, SON, and WLPs), details of camera modules, Price $250 (28 slides).

    • Fitbit Charge HR/JAWBONE UP3 JL-010ACA-JP Silver Cross, Fitbit Charge with 8 packages (FLGA, ceramic LGA, QFN, DFNs, and WLPs, UP3 with 17 packages (FLGA, ceramic LGA, QFNs, DFNs, and WLPs), Price $250 (35 slides).

    • LOGBAR Ring ZERO, 5 packages (QFNs DFN, SOP, WLP), Price $200, (11 slides).

    February 2016

    • Fujitsu Arrows NX, F-02H, 42 packages (FBGAs, FLGAs, CLGAs, SOs, QFNs, SONs, WLPs, PoP), details of display, camera modules, retina identification biometric authentication, Price $500 (94 slides).

    • Sharp AQUOS ZETA SH-01H, 40 packages (FBGAs, FLGAs, CLGAs, SONs, QFNs, WLPs, PoP), details of fingerprint sensors, touch screen, display, and camera modules, Price $500 (102 slides).

    • Sony Xperia Z5 Premium, SO-03H, 33 packages (FBGAs, FLGAs, CLGAs, QFNs, WLPs, PoP) details of display and camera modules, shows use of heat pipes, Price $500 (108 slides).

    January 2016

    • Samsung Galaxy S6, SM-G9200 (SIM Free Version), 39 packages (FBGA, FLGA, CLGA, QFN, SON, SO and WLPs), including 2 PoPs, details of camera modules, fingerprint sensor, display, heart rate sensor, and application processor, Price $500 (159 slides).

  • Semiconductor Market Reports – IC Insights
    visit IC Insights
    IC Insights provides complete analysis of the semiconductor market with coverage including current business, economic, and technology trends, capital spending and wafer capacity trends, the impact of new devices on the market, and other relevant semiconductor industry information.
Open all
Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
Network
Contact
  • email message
  • +1.512.372.8887
  • +1.512.372.8889
  • 4801 Spicewood Springs Rd, Ste 150
    Austin, TX 78759
    United States