• SiP for Mobile and Wearable Applications
    Market Forecasts and the Changing Business Model
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  • 2017 Flip Chip and WLP
    Market Forecasts and Technology Analysis
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  • 2015 Flip Chip and WLP
    Emerging Trends and Market Forecasts
    brochure
  • 3D IC Gap Analysis
    Remaining Issues, Solutions, Market Status
    brochure
  • 3D TSV Markets (2012)
    Applications, Issues, and Alternatives
    brochure
  • High Brightness LEDs (2011)
    Assembly Trends, Materials, and Issues
    brochure
  • Emerging Trends in Wafer Singulation (2010)
    brochure
  • 2010 Flip Chip and WLP
    Market Projections and New Developments
    brochure
  • 2008 Flip Chip and WLP (updated for 2009)
    Trends and Market Forecasts
    brochure
  • Through Silicon Via Technology (2008)
    The Ultimate Market for 3D Interconnect
    brochure
  • Embedded Active Components and Integrated Passives (2007)
    Technologies and Markets
    brochure
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TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
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