Volume 4-0125

January 2025
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This issue of the Advanced Packaging Update features a financial analysis of OSATs. Trends in the semiconductor industry and drivers for the industry are discussed. Growth in AI market with package examples is included. An update on co-packaged optics is provided. A special section is devoted to mobile communications via satellites.
  • Contents…
    •  1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Semiconductor Sector
        • 1.2.1 AI Hardware
        • 1.2.2 Smartphones
        • 1.2.3 PCs
        • 1.2.4 Automotive Electronics
    • 2 OSAT Financial Analysis
      • 2.1 Industry Overview
      • 2.2 OSAT Market Performance
      • ​2.3 Company Highlights
        • 2.3.1 ASE Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET Group
        • 2.3.4 Tongfu Microelectronics
        • 2.3.5 Powertech Technology
        • 2.3.6 UTAC
        • 2.3.7 Huatian
        • 2.3.8 KYEC
        • 2.3.9 ChipMOS
        • 2.3.10 Chipbond
      • 2.4 Outlook
    • 3 AI Growth
      • 3.1 New Export Restrictions
      • 3.2 Energy Consumption
      • 3.3 Data Center Hardware
        • 3.3.1 Amazon
        • 3.3.2 AMD
        • 3.3.3 Apple
        • 3.3.4 Broadcom
        • 3.3.5 Intel
        • 3.3.6 Microsoft
        • 3.3.7 Nvidia
      • 3.4 Edge AI
        • 3.4.1 Personal Computers
          • 3.4.1.1 AMD
          • 3.4.1.2 Intel
          • 3.4.1.3 Nvidia
          • 3.4.1.4 Qualcomm
        • 3.4.2 Smartphones
        • 3.4.3 Automotive
        • 3.4.4 Robotics
        • 3.4.5 Smart Glasses
      • 3.5 AI Package Forecast
    • 4 Co-Package Optics Developments
      • 4.1 Ayer Labs
      • 4.2 Broadcom
      • 4.3 Cisco
      • 4.4 IBM
      • 4.5 IMEC
      • 4.6 Intel
      • 4.7 Lightmatter
      • 4.8 Marvell
      • 4.9 NTT
      • 4.10 Nvidia
      • 4.11 TSMC
      • 4.12 Substrate Developments
        • 4.12.1 Silicon Embedded Interposers
        • 4.12.2 Fan-out RDL Interposers
          • 4.12.2.1 AIST
          • 4.12.2.2 IME A*STAR
          • 4.12.2.3 SPIL
        • 4.12.3 Glass
          • 4.12.3.1 FICT
          • 4.12.3.2 Intel
          • 4.12.3.3 Shinko Electric
          • 4.12.3.4 Sumitomo
          • 4.12.3.5 Toppan
      • ​4.13 OSATs
        • 4.13.1 Amkor Technology
        • 4.13.2 ASE
        • 4.13.3 IBM Bromont
        • 4.13.4 GlobalFoundries
        • 4.13.5 SPIL
    • 5 Satellite Connectivity
      • 5.1 Products and Services
        • 5.1.1 Apple
        • 5.1.2 Huawei
        • 5.1.3 Qualcomm
        • 5.1.4 MediaTek
        • 5.1.5 UNISOC
        • 5.1.6 Nordic
        • 5.1.7 ASE
        • 5.1.8 SpaceX Starlink
        • 5.1.9 SpaceX Starlink Mini
        • 5.1.10 AST SpaceMobile
        • 5.1.11 Iridium
        • 5.1.12 Lynk Global
        • 5.1.13 SpaceRISE IRIS
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 4.1 Broadcom's CPO.
    • 4.2 EICs and PICs fan-out on substrate.
    • 4.3 ASIC large body substrate with metal frame.
    • 4.4 IBM CPO.
    • 4.5 Passage cross section.
    • 4.6 Passage package architecture.
    • 4.7 Embedded packaging substrate using 2.3D RDL interposer.
    • 4.8 FOWLP for CPO.
    • 4.9 PIC and EIC integration process flow.
    • 5.1 ASE's satellite communication SiP module.
  • Tables…
    • 2.1 OSATs Q3 2024 Revenue Growth
    • 2.2 Top 20 OSATs Q3 2024 Revenue Growth
    • 3.1 AI Packages
    • 3.2 Market Projections for AI Packages
    • 4.1 CPO versus Pluggable Optical Interconnect
    • 5.1 Satellite Connectivity Service Providers
    • 5.2 Satellite Communication Standards in 3GPP's 5G Release 17
    • 5.3 Packages in Starlink Mini

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