Besides our Advanced Packaging Update reports, we publish a series of multi-client reports in the semiconductor packaging and assembly field.

Newest Reports

  • * NEW *

    2017 Flip Chip and WLP

    Market Forecasts & Technology Analysis
    • Detailed analysis of drivers for fan-in WLP, FO-WLP, and flip chip
    • Covers chip package interaction (CPI) and Cu pillar trends
    • Wafer demand vs. capacity comparisons for flip chip and WLP
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  • SiP for Mobile & Wearable Apps

    Market Forecasts, Changing Business Model
    • Examines what’s fueling system-in-package growth
    • Medical, automotive, high-performance systems also covered
    • Business models, enabling technologies, design tools
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  • 3D IC Gap Analysis

    Remaining Issues, Solutions, Market Status
    • Looks at what’s holding back broad application of 3D IC
    • Covers great progress made and challenges that remain
    • New developments, market forecast, suppliers
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Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
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  • +1.512.372.8889
  • 4801 Spicewood Springs Rd, Ste 150
    Austin, TX 78759
    United States