Embedded Components: Why Now?

Market, Applications, and Technologies
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Almost every application space in the electronics industry has evolved around a single goal—increase functionality while improving cost/performance. Many strategies and technologies have been introduced, including embedded components. Active or passive components can be embedded inside a printed circuit board or IC package. Passives such as resistors and capacitors can be formed on a surface or layer to become part of the internal stack-up of a circuit board.

What’s driving today’s renewed interest for embedded active and passive functions? This report analyzes the expanding wide range of markets providing insight into the drivers, applications, and future growth. It looks at changes and advancements that have been made to deliver improved embedded solutions.

Both formed passive components, along with placed active and passive devices in IC packages, modules and printed circuit boards are addressed. Fan-out wafer level packages are included in the analysis. Major players in the infrastructure for the technology are described. A discussion of the challenges posed by embedded solutions and the potential impact of the technology on the supply chain is included.

A set of PowerPoint slides accompanies the report.
  • Contents…
    • Executive Summary
    • 1 Introduction
      • ​1.1 Definitions
    • 2 Placed Embedded Actives and Passives
      • ​Advanced Engineering, Inc., ASE, Amkor Technology, AT&S, DNP, Deca Technologies, DYCONEX/MST, FCI/Fujikura, Freescale, Fuji Print, GE and Imbera, Ibiden, Infineon, Intel, J-Devices Corporation, Meiko Electronics, Murata, NANIUM, NTK, NXP, SEMCO, Schweizer Electronic, Shinko Electric Industries, SPIL, STATS ChipPAC, Taiyo Yuden, TDK-EPC, TI, TSMC, Unimicron, Wurth Elektronik, and YKC
    • 3 Embedded Formed Passives
      • 3.1 Formed Resistors
        • Asahi Chemical Research Lab, Embed Technology, Electra Polymers, Ohmega Technologies, and Ticer Technologies
      • 3.2 Formed Capacitors
        • Oak Mitsui, 3M, DuPont, and Embed Technology
      • 3.3 Resistor and Capacitor Materials
    • 4 Infrastructure
      • 4.1 Design
      • 4.2 Components
      • 4.3 Equipment
      • 4.4 Cost Trade-Offs
        • 4.4.1 Formed Embedded Passives
        • 4.4.2 Embedded Passives and Actives
      • 4.5 Standards
    • 5 Market Projections
      • 5.1 Embedded Active and Passive Devices
        • 5.1.1 Embedded Capacitors
        • 5.1.2 Power Devices
          • Mobile, Computing, and Telecom
          • Automotive Electronics
        • 5.1.3 Market Forecast
      • 5.2 Formed Embedded Components
        • 5.2.1 Formed Resistor Materials
        • 5.2.2 Formed Capacitance Materials
      • 5.3 Future Applications
        • 5.3.1 Medical Electronics
        • 5.3.2 Wearable Electronics
  • Figures (partial list)…
    • ASE's a-EASI substrate
    • ECP® process flow
    • Embeddable WLP and discrete passive components
    • Cross-section of wireless communication module
    • B2it™ embedded-device substrate
    • Embedded B2it™ PoP
    • Cross-section and photograph of ChipsetT™
    • Cross-section of ChipsetT™
    • GE ePOL process flow
    • J-Device WFOP™
    • i2 Board process flow
    • p2 Pack solution for direct drive motor
    • Taiyo Yuden's EOMIN® embedded substrate
    • SESUB cross-section
    • SESUB battery charging module
    • TI’s MicroSiP™
    • Embedded passive component substrate process
    • Two-layer UTS-EP structure
    • ECT-μVia process flows
    • ECT-FC process
    • Design rules for Wurth embedded offerings
    • Cross-section of medical implant device
    • Thin film resistor process
    • Cross section of resistors printed with EBR
    • OhmegaPly® material
    • Processing steps for TCR® with NiCr
    • Cross-section of FaradFlex material
    • Two 3M™ ECM cores separated by 8μm FR-4 core
    • Discrete capacitor elimination on telecom board
    • Process flow for formed capacitors with EBC®
    • AVX ultra-thin components
    • Infineon CIPOS™ module
    • 50 kW inverter migrated to embedded die solution
    • MEMS microphone
  • Tables (partial list)…
    • Typical Values for Flip Chip (Solder) and WLP
    • Demand for Solder Bumped and Copper Pillar ICs
    • Solder Bump and Copper Pillar Capacity
    • Demand for Gold Bumped ICs
    • Copper Pillar Capacity and Demand Projections
    • Fan-In Wafer Level Package Demand
    • Fan-In WLP Capacity and Demand Projections
    • Component Level eWLB Reliability
    • eWLB Board Level Reliability
    • FO-WLP Panel Sizes Under Development
    • PLP Reliability Test Results
    • Pb-Free Flip Chip Bump Metallurgy
    • Merchant and Captive Bump Capacity
    • Gold Bump Merchant & Captive Capacity Projections
    • Demand for Solder Bumped and Cu Pillar ICs
    • Flip Chip Die Size and Bump Examples
    • Demand for Gold Bumped ICs
    • Solder Bump Demand by Device Type
    • Flip Chip Examples in Mobile Products
    • Conventional WLP Examples
    • Fan-out WLP Examples
    • Companies Offering FO-WLP
    • Fan-in WLP Capacity and Demand Projections
    • Fan-in Wafer Level Package Demand
    • WLPs in Smartphones
    • WLPs in Tablets
    • WLP and Bump Service Providers
    • Comparison of FC Attach Processes
    • High Precision Bonders
    • Pick-and-Place System
  • Published January 2014
  • 134 pages
  • 78 figures / 45 tables
  • 40 PowerPoint slides
  • $4,995 single user
    $8,000 corporate license
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