Stacks Image 17774
  • Reports priced individually. Contact us to order or get more information.
TechSearch International recently began performing teardowns of leading-edge and prominent system products, including smartphones from Samsung, Apple, and Huawei, smartwatches such as the Apple Watch, and consumer electronics including the Ring Video Doorbell and Nest Learning Thermostat.

Teardowns from TechSearch International focus on the advanced semiconductor packaging aspects of the systems.
  • All Chip Packages Covered: We analyze each advanced semiconductor package in the system as well as in accessories included with the product. Advanced packages include WLPs, FO-WLPs, laminate CSPs like FBGAs and FLGAs, leadframe CSPs like QFNs and SONs/DFNs, ceramic CSPs, and bare die technologies such as flip-chip-on-flex and chip-on-board.
  • All Devices Inside Modules/SiPs Covered: We also decapsulate the multi-die modules and system-in-package devices to examine all flip chip, wire bond, and pre-packaged devices contained within them.
  • Comprehensive Package and Die Details Include:
    – Supplier, part number, and marking
    – Package type and class
    – Package dimensions
    – Contact type, count, and pitch
    – Shielding and underfill
    – Die supplier and device type
    – Die count, size, and placement
    – Die bond count and pitch
    – Flip chip, wire bond, material type
  • Superb Imaging and X-rays with High-Resolution: We take high-quality photographs and provide them in high-resolution format. In partnership with Creative Electron (creativeelectron.com), we are able to produce excellent x-ray images of packages using Creative Electron's tools.
  • Package and Die Data Categorized and Summarized: We compile data to provide breakdowns of package and die counts by package type, package class, and supplier geographic location. Total package and die surface areas are determined.
Recent teardowns:
  • iPhone 13 Pro
    My Image
    brochure
  • Samsung Galaxy Watch4 Wi-Fi+LTE
    My Image
    brochure
  • Xiaomi Mi 11
    My Image
    brochure
  • Apple Watch Series 6 GPS+LTE
    My Image
  • Huawei Mate 30 5G
    My Image
  • Other recent teardowns

    • Samsung Galaxy Buds+
    • Apple iPad Pro 11-inch (3rd gen)
    • Jabra Elite Active 75t
    • Apple AirPods Pro
    • Poco X3 Pro
    • Samsung Galaxy Book S
    • Huawei Mate 30 5G
    • Fitbit Charge 3
    • iPhone 12 Pro

Teardown Reports from TPSS Group

TechSearch International is also a reseller of teardown reports from Total Process Solution Study Group (TPSS) in Japan.

view TPSS reports
Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
Network
Contact
  • email message
  • +1.512.372.8887
  • +1.512.372.8889
  • 4801 Spicewood Springs Rd, Ste 150
    Austin, TX 78759
    United States