The Advanced Packaging Update features special coverage of market and technology developments for BGAs, CSPs, stacked die CSPs, flip chip, and wafer level packages. Each issue includes new applications, developments in materials and assembly equipment, and new package constructions.

Example topics:

  • Stacked die CSP trends
  • Packaging trends for mobile and wearable electronics such as smartphones including color photos and x-rays of components
  • Interposer developments including silicon, organic, and glass
  • Reliability data for new packages
  • New assembly materials
  • IC package substrate design rules and trends
  • New wafer level package versions and suppliers
  • Embedded component packages
  • Power device packages
  • DRAM packaging trends
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