Volume 1-0422

April 2022
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This issue of the Advanced Packaging Update features a detailed financial analysis of the top 20 OSATs. A special section examines the impact of the war in Ukraine and China’s lockdowns. The expansion of cryptocurrency and its impact on energy consumption and packaging and assembly services are discussed. The market forecast for Ball Grid Arrays (BGAs) and Chip Scaled Packages (CSPs) is provided in units. Package examples and demand drivers are provided. An update on the build-up substrate market is provided. The CSP market is divided into laminate (FBGA and FLGA) and leadframe (QFN) substrates. Stacked die package trends are included. Unit growth projections for Cu clip and molded interconnect substrates (MIS) are provided. Estimates of the market for each package type are based on input from captive and from merchant assembly operations.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Semiconductor Industry Expansion
        • 1.2.1 China
        • 1.2.2 Europe
        • 1.2.3 India
        • 1.2.4 Japan
        • 1.2.5 Taiwan
        • 1.2.6 U.S.
      • 1.3 China's Covid Lockdowns
      • 1.4 War in Ukraine
      • 1.5 Semiconductor Shortages
    • 2 OSAT Financial Analysis
      • 2.1 Industry Overview
      • 2.2 OSAT Market Performance
        • 2.2.1 Assembly and Test Revenue Splits
      • 2.3 Company Highlights
        • 2.3.1 ASE Technology Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET Group
        • 2.3.4 Powertech Technology
        • 2.3.5 Tongfu Microelectronics
        • 2.3.6 Tianshui Huatian Technology
        • 2.3.7 KYEC
        • 2.3.8 UTAC
        • 2.3.9 ChipMOS
        • 2.3.10 Chipbond
      • 2.4 OSAT Performance Metrics
        • 2.4.1 Gross Margin
        • 2.4.2 R&D Spending
        • 2.4.3 CAPEX
      • 2.5 Outlook
    • 3 Cryptocurrency
      • 3.1 Mining Pools
      • 3.2 Energy Use and Efficiency
      • 3.3 Packages for Cryptocurrency
    • 4 BGA Applications and Markets
      • 4.1 Major Applications for BGA Packages
        • 4.1.1 Personal Computers
        • 4.1.2 Servers
        • 4.1.3 Artificial Intelligence
        • 4.1.4 GPUs and Gaming CPUs
        • 4.1.5 5G Infrastructure
        • 4.1.6 Satellites
        • 4.1.7 Automotive
      • 4.2 BGA Market Projections
    • ​5 CSP Applications and Markets
      • 5.1 Smartphones
        • 5.1.1 Apple iPhone 13 Pro
        • 5.1.2 Samsung Galaxy S21 Ultra 5G
        • 5.1.3 Xiaomi Mi 11
        • 5.1.4 Sony Xperia 1 Mark III
        • 5.1.5 Poco X3 Pro
      • 5.2 Tablets
        • 5.2.1 Apple iPad Pro 11-inch Wi-Fi
      • 5.3 Laptops
      • ​5.4 Wearables
        • 5.4.1 Galaxy Watch4 (Wi-Fi + LTE)
        • 5.4.2 Fitbit Versa 3
        • 5.4.3 Jumei Technology F29 Fitness Tracker
        • 5.4.4 Sony Wena 3 Fitness Tracker
        • 5.4.5 Meta Quest 2 VR Headset
        • 5.4.6 Samsung Galaxy Buds2
        • 5.4.7 Jabra Elite Active 75t Wireless Earbuds
      • 5.5 Smart Home
        • 5.5.1 Google Nest Hub 2
        • 5.5.2 Amazon Echo Dot
        • 5.5.3 Eero 6 Mesh Wi-Fi Router
        • 5.5.4 Google Nest Mesh Wi-Fi Router
      • 5.6 Automotive
      • 5.7 Package Trends
        • 5.7.1 QFNs
          • 5.7.1.1 Cu Clip QFN/DFN
        • 5.7.2 Molded Interconnect Substrates
        • 5.7.3 Laminate CSPs
          • 5.7.3.1 FBGAs
          • 5.7.3.2 FLGAs
          • 5.7.3.3 Double-Sided FBGAs
        • 5.7.4 Stacked Die CSPs
        • 5.7.5 PoP Developments
      • 5.8 CSP Market Projections
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 4.1 AMD Instinct MI200 with Elevated Fanout Bridge.
    • 4.2 Ponte Vecchio with Foveros and EMIB.
  • Tables…
    • 1.1 Proposed S. 1260 Appropriations for CHIPS for America
    • 1.2 End Product Growth
    • 2.1 Revenue of Top 20 OSATs
    • 2.2 Impact of Local Currency to USD Conversion
    • 2.3 Top 10 Assembly and Test Revenue Split
    • 2.4 Gross Margin for Top Nine OSATs
    • 2.5 R&D Spending for Top Nine OSATs
    • 2.6 CAPEX for Top Nine OSATs
    • 2.7 Top Four OSAT CAPEX Trends
    • 2.8 TSMC Revenue and CAPEX
    • 3.1 Economic Incentive Systems/Monetary Policy Variations
    • 3.2 Bitcoin and Ethereum Carbon Footprint
    • 3.3 Hardware Efficiencies for Bitcoin Applications
    • 4.1 Laptop and Desktop CPU Packages
    • 4.2 Server CPU Packages
    • 4.3 AI Accelerator Package Examples
    • 4.4 GPU and Gaming Processor Packages
    • 4.5 PBGA/LGA Market Projections
    • 5.1 Apple iPhone 13 Pro CSPs
    • 5.2 CSP Comparison Between iPhone 12 Pro and iPhone 13 Pro
    • 5.3 Select CSPs in iPhone 13 Pro
    • 5.4 Samsung Galaxy S21 Ultra 5G CSPs
    • 5.5 Galaxy S21 Ultra 5G and S20 Ultra 5G CSP Comparison
    • 5.6 Xiaomi Mi 11 CSPs
    • 5.7 Selected CSPs in Xiaomi Mi 11
    • 5.8 Selected CSPs in Sony Xperia 1 Mark III
    • 5.9 CSP Summary from Poco X3 Pro Teardown
    • 5.10 Select CSPs in Poco X3 Pro
    • 5.11 Apple iPad Pro 11-inch Wi-Fi CSPs
    • 5.12 2nd-Gen and 3rd-Gen iPad Pro 11-inch CSP Comparison
    • 5.13 Selected CSPs in Apple iPad Pro 11-inch Wi-Fi
    • 5.14 Galaxy Watch4 (Wi-Fi + LTE) CSPs
    • 5.15 Selected CSPs in Galaxy Watch4 (Wi-Fi + LTE)
    • 5.16 Fitbit Versa 3 CSPs
    • 5.17 Selected CSPs in Fitbit Versa 3 Smartwatch
    • 5.18 CSPs in Jumei Technology F29 Fitness Tracker
    • 5.19 CSPs in Sony Wena 3 Fitness Tracker
    • 5.20 Selected CSPs in Meta Quest 2 Headset
    • 5.21 Galaxy Buds2 CSPs
    • 5.22 Galaxy Buds and Galaxy Buds2 CSP Comparison
    • 5.23 Selected CSPs in Galaxy Buds2
    • 5.24 Jabra Elite Active 75t CSPs
    • 5.25 Selected CSPs in Jabra Elite Active 75t Earbuds
    • 5.26 Nest Hub 2 CSPs
    • 5.27 4th Gen Echo Dot CSP Summary
    • 5.28 CSPs in 4th Gen Echo Dot
    • 5.29 Eero 6 Mesh Wi-Fi Router CSP Summary
    • 5.30 CSPs in Eero 6 Mesh Wi-Fi Router
    • 5.31 Google Nest Mesh Wi-Fi Router CSP Summary
    • 5.32 CSPs in Google Nest Mesh Wi-Fi Router
    • 5.33 QFN Examples
    • 5.34 SON/DFN Examples
    • 5.35 Cu Clip QFNs/SONs/DFNs Examples
    • 5.36 Market Growth for QFN Cu Clip
    • 5.37 MIS Package Examples
    • 5.38 Market Growth for MIS Packages
    • 5.39 FBGA Examples
    • 5.40 FLGA Examples
    • 5.41 Double-Sided FBGA Examples
    • 5.42 Stacked Die CSP Examples
    • 5.43 PoP Examples
    • 5.44 CSP Market Projections

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  • Published April 2022
  • 96 pages
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