Volume 4-0122

January 2022
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This issue of the Advanced Packaging Update features a financial analysis of OSATs. Continuing semiconductor shortages and supply chain disruptions are discussed. Trends in the semiconductor industry are described, including investment plans. A special section is devoted to developments in hybrid bonding 3D ICs. An update on automotive electronics with a focus on electric vehicle and infrastructure growth is provided. Growing applications for SiC are discussed and package trends are highlighted.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 China's Power Shortages
      • 1.3 Supply Chain Challenges
      • 1.4 Semiconductor Capacity Expansion
        • 1.4.1 TSMC
        • 1.4.2 Intel
    • ​2 OSAT Financial Analysis
      • 2.1 Industry Overview
      • 2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET Group
        • 2.3.4 Powertech Technology
        • 2.3.5 Tongfu Microelectronics
        • 2.3.6 Huatian
        • 2.3.7 KYEC
        • 2.3.8 UTAC
        • 2.3.9 ChipMOS and Chipbond
        • 2.3.10 Sigurd, Ardentec, and Tong Hsing
      • 2.4 Outlook
    • 3 Hybrid Bonding for Chiplets
      • 3.1 TSMC's SoIC™
      • 3.2 AMD's V-Cache
      • 3.3 Intel's Foveros Direct
      • 3.4 IBM Research
      • 3.5 Samsung Electronics
    • 4 Substrate Shortages
      • 4.1 Substrate Size and Features
        • 4.1.1 Increased Body Sizes
        • 4.1.2 Substrate Complexity
        • 4.1.3 New Substrate Technology Requirements
      • 4.2 Supply and Demand for FC-BGA
      • 4.3 Substrate Trends
        • 4.3.1 New Substrate Suppliers
          • 4.3.1.1 SKC Korea
      • ​4.4 Improving Substrate Yield
        • 4.4.1 Metrology Developments
    • ​5 Electric Vehicle (E-Drive) Market
      • 5.1 EV Components
        • 5.1.1 Powertrain
        • ​5.1.2 Increased Use of MOSFETs
        • 5.1.3 EV Charging Stations
        • 5.1.4 Materials for SiC Packages
          • 5.1.4.1 Die Attach
          • ​5.1.4.2 Encapsulation Materials
          • 5.1.4.3 Embedded Die
        • 5.1.5 Component Reliability Requirements
        • 5.1.6 Components in Autonomous Driving EVs
      • 5.2 E-drive Companies
        • 5.2.1 BMW
        • 5.2.2 BYD
        • 5.2.3 Ford
        • 5.2.4 General Motors
        • 5.2.5 Hyundai
        • 5.2.6 Stellantis
        • 5.2.7 Tesla
        • 5.2.8 Toyota
        • 5.2.9 Volkswagen
        • 5.2.10 Mercedes-Benz
        • 5.2.11 The Lucid Group
      • 5.3 Semiconductor Suppliers
        • 5.3.1 Infineon
        • 5.3.2 NXP
        • 5.3.3 STMicroelectronics
        • 5.3.4 Rohm Semiconductor
        • 5.3.5 Renesas
        • 5.3.6 Onsemi
        • 5.3.7 Wolfspeed
      • 5.4 Battery Cell and Battery Pack
        • 5.4.1 Battery Module Assembly
        • 5.4.2 Battery Suppliers
          • 5.4.2.1 Automotive Cells Company
          • 5.4.2.2 BYD
          • 5.4.2.3 Contemporary Amperex Technology Co.
          • 5.4.2.4 LG Chem
          • 5.4.2.5 Microvast
          • 5.4.2.6 Norhvolt
          • 5.4.2.7 Panasonic
          • 5.4.2.8 Romeo Power
          • 5.4.2.9 Samsung SDI
          • 5.4.2.10 SK Innovation
          • 5.4.2.11 QuantumScape
        • 5.4.3 Rare Earth Materials
    • ​​6 U.S. 5G Rollout Hits a Speed Bump
      • 6.1 What is C-Band?
      • 6.2 North American Infrastructure for 5G
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 3.1 AMD 3D V-Cache.
    • 3.2 Intel's Foveros Direct.
    • 4.1 Measurement density for inline metrology system.
    • 5.1 Powertrain components in an electric vehicle.
  • Tables…
    • 2.1 Top 20 OSATs 2021 Quarterly Revenue
    • 3.1 SoIC™ Compared to 2.5D and Conventional 3D IC
    • 4.1 FC-BGA Substrate Supply and Demand
    • 4.2 FC-BGA Substrate High Layer Count Demand
    • 4.3 Impact of mSAP Adoption for Lower Layer Counts
    • 4.4 Impact of Substrate Yield Enhancement
    • 5.1 Fully Electric Vehicle Launches
    • 5.2 Powertrain High-Power Device Examples
    • 5.3 Select Packages in Tesla Model 3 Computer Board
    • 5.4 Battery Cell and Battery Pack Down-Stream Supply Chain
    • 5.5 Global Mineral Reserves
    • 5.6 Global Mining Production by Country and Mineral
    • 6.1 Speed Test Results
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  • Published January 2022
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