Volume 4-0124

January 2024
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This issue of the Advanced Packaging Update features a financial analysis of OSATs. A special section is devoted to government investments in the semiconductor industry. Trends in the semiconductor industry are discussed. High-performance advanced packaging offerings from major foundries and OSATs are compared. Market trends for AI and applications are highlighted. An update on supply and demand in the build-up substrate market is provided. The fine pitch flip chip bonder equipment market is described.
  • Contents…
    •  1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Semiconductor Sector
        • 1.2.1 Smartphone Recovery
        • 1.2.2 PC Recovery
        • 1.2.3 Japan Earthquake
    • ​2 OSAT Financials
      • 2.1 Industry Overview
      • 2.2 OSAT Market Performance
      • 2.3 Company Highlights
        • 2.3.1 ASE Holdings
        • 2.3.2 Amkor Technology
        • 2.3.3 JCET Group
        • 2.3.4 Tongfu Microelectronics
        • 2.3.5 Powertech Technology
        • 2.3.6 Huatian
        • 2.3.7 UTAC
        • 2.3.8 KYEC
        • 2.3.9 Chipbond
        • 2.3.10 ChipMOS
      • 2.4 Outlook
    • 3 Government Investments
      • 3.1 China
      • 3.2 European Union
      • 3.3 India
      • 3.4 Japan
      • 3.5 Malaysia
      • 3.6 Singapore
      • 3.7 South Korea
      • 3.8 Taiwan
      • 3.9 United Kingdom
      • 3.10 United States
        • 3.10.1 Federal Funding
        • 3.10.2 State and Local Incentives
    • ​4 Foundry and OSAT HPC Options
      • 4.1 Amkor
      • 4.2 ASE
      • 4.3 Intel
      • 4.4 JCET Group
      • 4.5 Powertech Technology
      • 4.6 Samsung
      • 4.7 SPIL
      • 4.8 Tongfu Microelectronics
      • 4.9 TSMC
    • 5 Expanding AI Markets
      • 5.1 Cloud Services
        • 5.1.1 Amazon
        • 5.1.2 AMD
        • 5.1.3 IBM
        • 5.1.4 Microsoft
        • 5.1.5 Nvidia
      • 5.2 Personal Computers
      • 5.3 Automotive ADAS
        • 5.3.1 Moving to Chiplets
        • 5.3.2 AEC Qualification Changes
      • 5.4 AI Package Forecast
    • 6 Build-up Substrates
      • 6.1 Build-up Substrate Supply and Demand
        • 6.1.1 Demand Drivers for Build-up Substrates
        • 6.1.2 Build-up Capacity Adjustments
        • 6.1.3 Supply and Demand Analysis
        • 6.1.4 Substrate Industry Revenue Declines
        • 6.1.5 Future Substrate Constructions
    • ​7 Flip Chip Bonding Equipment
      • 7.1 Laser Assisted Bonding
      • 7.2 Thermo-Compression Bonding
      • 7.3 TCB Bonder Shipments
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 5.1 AMD Instinct MI300 modular chiplet package.
    • 5.2 Connecting chiplets in 3.5D.
    • 5.3 IBM Research's NorthPole.
  • Tables…
    • 2.1 Top 20 OSATs Q3 2023 Revenue Growth
    • 3.1 U.S. Federal Government Funding
    • 3.2 DoD Awards for ME Commons Hubs
    • 3.3 Selected State Incentives
    • 3.4 Selected State and Local Funding
    • 4.1 High-Performance Package Assembly Offerings
    • 4.2 TSMC's SoIC™ Roadmap
    • 5.1 Market Projections for AI Packages
    • 6.1 Build-up Substrate Supply and Demand
    • 7.1 Production Bonders for TCB
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  • Published January 2024
  • 59 pages
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  • 59 PowerPoint slides
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