Teardowns by TechSearch International
Disassembly of leading-edge electronic products to gain insight into advanced packaging technologies
- Reports priced individually. Contact us to order or get more information.
TechSearch International gains deep understanding of advanced packaging technologies through a combination of constant close communication with key players in the industry and teardowns of leading-edge system products to examine packaging technologies in mass production. Our teardowns focus on the advanced semiconductor packaging aspects of the systems.
Results from our own teardown projects can be found throughout our Advanced Packaging Update and other reports. Teardown reports can also be purchased individually.
Results from our own teardown projects can be found throughout our Advanced Packaging Update and other reports. Teardown reports can also be purchased individually.
- All Chip Packages Covered: We analyze each advanced semiconductor package in the system as well as in accessories included with the product. Advanced packages include WLPs, FO-WLPs, laminate CSPs like FBGAs and FLGAs, leadframe CSPs like QFNs and SONs/DFNs, ceramic CSPs, and bare die technologies such as flip-chip-on-flex and chip-on-board.
- All Devices Inside Modules/SiPs Covered: We also decapsulate the multi-die modules and system-in-package devices to examine all flip chip, wire bond, and pre-packaged devices contained within them.
- Comprehensive Package and Die Details Include:– Supplier, part number, and marking
– Package type and class
– Package dimensions
– Contact type, count, and pitch
– Shielding and underfill
– Die supplier and device type
– Die count, size, and placement
– Die bond count and pitch
– Flip chip, wire bond, material type - Superb Imaging and X-rays with High-Resolution: We take high-quality photographs and provide them in high-resolution format. In partnership with Comet Yxlon (yxlon.comet.tech), we are able to produce excellent high-resolution X-ray images of packages using Comet Yxlon's tools.
- Package and Die Data Categorized and Summarized: We compile data to provide breakdowns of package and die counts by package type, package class, and supplier geographic location. Total package and die surface areas are determined.
Recent teardowns:
Other recent teardowns
- Google Pixel 8 Pro
- Samsung Galaxy A35 5G
- Samsung Galaxy A15 5G
- Motorola Moto G (2024)
- Samsung Galaxy Watch6 with LTE
- Apple iPhone 16 Pro Max
- Microsoft Surface Pro 9
- Huawei Mate 60 Pro
- Amazon Echo Dot (5th gen)
- Anker Nano II 65W GaN charger
- Samsung 45W Super Fast GaN charger
- Arlo Pro 4 security camera
- August Wi-Fi Smart Lock
Who We Are
TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging and assembly, electronics manufacturing, and materials.
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- +1.512.372.8887
- +1.512.372.8889
- 4801 Spicewood Springs Rd, Ste 150
Austin, TX 78759
United States
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