Volume 1-0420

April 2020
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This issue of the Advanced Packaging Update features a detailed financial analysis of the assembly service providers and an outlook for the remainder of 2020. The impact of Covid-19 is analyzed and potential growth areas coming out of the pandemic are discussed. Special sections on 5G infrastructure, Industrial IoT, and high-performance computing packaging trends are included. Special coverage of the market with a forecast for units of BGAs and CSPs by package construction is provided. The CSP market is divided into laminate and leadframe (QFN) substrates. Unit growth projections for Cu clip and package-on-package (PoP) are provided. Estimates of the market for each package type are based on input from captive as well as merchant assembly operations.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Covid-19 Impact on Semiconductor Industry
    • 2 Growth Areas Despite Covid-19
      • 2.1 Artificial Intelligence, Gaming, Networking
      • 2.2 5G Adoption
        • 2.2.1 5G Infrastructure Rollout Continues
        • 2.2.2 5G Smartphones
      • 2.3 Servers
      • 2.4 Medical and Health Care
      • 2.5 Industrial IoT
        • 2.5.1 Bosch
        • 2.5.2 ON Semiconductor
        • 2.5.3 Infineon
        • 2.5.4 Cypress Semiconductor
        • 2.5.5 NXP
        • 2.5.6 STMicroelectronics
        • 2.5.7 Texas Instruments
      • 2.6 Limits to Growth
        • 2.6.1 Component Shortages
        • 2.6.2 Suppy Chain Disruptions
        • 2.6.3 Shortages of 200mm Wafer Capacity
    • 3 OSAT Financial Analysis
      • 3.1 Definitions
      • 3.2 Industry Factors
      • 3.3 OSAT Market Overview
        • 3.3.1 2019 OSAT Market Performance
          • 3.3.1.1 ASE+SPIL
          • 3.3.1.2 Amkor Technology
          • 3.3.1.3 Powertech Technology
          • 3.3.1.4 TFME
          • 3.3.1.5 King Yuan Electronics Co.
          • 3.3.1.6 Chipbond and ChipMOS
          • 3.3.1.7 Additional Growth Companies
      • 3.4 Observations
      • 3.5 Outlook
    • 4 BGA Applications and Markets
      • 4.1 BGA Market Projections
    • 5 CSP Applications and Markets
      • 5.1 Smartphones
      • 5.2 Tablets
      • 5.3 Laptops
      • 5.4 Wearables
        • 5.4.1 Smartwatches
        • 5.4.2 Fitness Trackers
        • 5.4.3 Smart Wireless Earbuds
        • 5.4.4 Wearable Action Cameras
      • 5.5 Smart Home
      • 5.6 Consumer: Game Consoles and iPod Touch
      • 5.7 Package Trends
        • 5.7.1 QFNs
          • 5.7.1.1 Cu Clip QFN/DFN
            • 5.7.1.1.1 Cu Clip Applications
            • 5.7.1.1.2 Assembly Services
            • 5.7.1.1.3 Cu Clip Market Growth
        • 5.7.2 Molded Interconnect Substrates
        • 5.7.3 Laminate CSPs
          • 5.7.3.1 Wire Bond
          • 5.7.3.2 Flip Chip FBGAs
          • 5.7.3.3 FLGAs
          • 5.7.3.4 Double-Sided FBGAs
        • 5.7.4 Stacked Die CSPs
        • 5.7.5 PoP Developments
          • 5.7.5.1 PoP Market Forecast
      • 5.8 CSP Market Projections
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 5.1 MIS process flow.
    • 5.2 YMTC Flash memory with W2W hybrid bonding.
    • 5.3 MCeP concept for PoP.
  • Tables…
    • 1.1 Semiconductor Revenue Forecast Scenarios for 2020
    • 2.1 AiP Market Growth for 5G mmWave Smartphones
    • 2.2 Semiconductor Companies Serving the IIoT Market
    • 2.3 Passive Component Vendors Experiencing Disruptions
    • 3.1 Revenues for Top 20 Publicly Traded OSATs
    • 3.2 Revenue Change for Select Publicly Traded OSATs
    • 3.3 Revised Ranking Top 20 Publicly Traded Companies
    • 3.4 Market Share Profile for Top 20 Publicly Traded OSATs
    • 3.5 OSAT CAPEX Trends (millions)
    • 4.1 Examples of Laminate Substrates for FC-PBGAs
    • 4.2 PBGA/LGA Market Projections (millions of units)
    • 5.1 CSP Summary from Apple iPhone 11 Pro Max
    • 5.2 Samsung Galaxy S10 5G CSPs (Snapdragon Model)
    • 5.3 Galaxy S10+ and Galaxy S10 5G CSP (Snapdragon Models)
    • 5.4 Huawei Mate 30 5G CSPs
    • 5.5 Select CSPs in Apple iPad 7th Generation (Wi-Fi Model)
    • 5.6 Select CSPs in NEC LAVIE Tab E (TE410)
    • 5.7 Select CSPs in Surface Laptop 3 (15-inch)
    • 5.8 Select CSPs in Xiaomi Mi Watch
    • 5.9 CSP Summary from Fitbit Charge 3
    • 5.10 CSP Summary from Samsung Galaxy Buds
    • 5.11 Select CSPs in Insta360 Go Action Camera
    • 5.12 Ring Video Doorbell 2 CSPs
    • 5.13 Nest Thermostat E CSPs
    • 5.14 CSP Summary from Philips Hue Bridge 2.1
    • 5.15 Select CSPs in Nintendo Switch Lite
    • 5.16 Select CSPs in iPod Touch (2019 Model)
    • 5.17 QFN Examples
    • 5.18 SON/DFN Examples
    • 5.19 OSATs with QFN/DFN Cu Clip Attach
    • 5.20 Market Growth for QFN Cu Clip
    • 5.21 Market Growth for MIS Packages
    • 5.22 Examples of FBGAs with Wire Bond
    • 5.23 FBGA with Flip Chip Examples
    • 5.24 FLGA-Package Examples
    • 5.25 Double-Sided FBGA Examples
    • 5.26 Stacked Die CSP Examples
    • 5.27 PoP Market Forecast
    • 5.28 CSP Market Projections (millions of units)

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