Volume 1-0521

May 2021
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This issue of the Advanced Packaging Update features a detailed financial analysis of assembly service providers and an outlook for the remainder of 2021. Continued semiconductor shortages are discussed. A special section on packaging trends for artificial intelligence (AI) from machine learning and training to edge computing is included. The market forecast for units of BGAs and CSPs is provided. The CSP market is divided into laminate and leadframe (QFN) substrates. Unit growth projections for Cu clip and package-on-package (PoP) are provided. Estimates of the market for each package type are based on input from captive as well as merchant assembly operations.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Semiconductor Industry Growth
      • 1.3 Semiconductor Shortages
        • 1.3.1 Automotive Sector
      • 1.4 Equipment and Materials
        • 1.4.1 Assembly Equipment
        • 1.4.2 Leadframes
        • 1.4.3 Laminate Substrates
        • 1.4.4 Resin
    • ​2 OSAT Financial Analysis
      • 2.1 Industry Overview
      • 2.2 OSAT Market
      • 2.3 OSAT Revenue
        • 2.3.1 Company Highlights
          • 2.3.1.1 ASE Technology Holdings
          • 2.3.1.2 Amkor Technology
          • 2.3.1.3 JCET Group
          • 2.3.1.4 Powertech Technology
          • 2.3.1.5 Tongfu Microelectronics
          • 2.3.1.6 Tianshui Huatian Technology
          • 2.3.1.7 King Yuan Electronics Co.
          • 2.3.1.8 UTAC
          • 2.3.1.9 ChipMOS
          • 2.3.1.10 Chipbond
      • ​2.4 OSAT Performance Metrics
        • 2.4.1 Gross Margin
        • 2.4.2 R&D Spending
        • 2.4.3 CAPEX
      • 2.5 Observations
      • 2.6 Foundry Competition for OSATs
        • 2.6.1 Intel's Re-Entry
        • 2.6.2 Samsung's Cube Packages
        • 2.6.3 TSMC's 3D Fabric™
    • ​3 BGA Applications and Markets
      • 3.1 Major Applications for BGA Packages
        • 3.1.1 Servers
        • 3.1.2 Artificial Intelligence
        • 3.1.3 Personal Computers
        • 3.1.4 Gaming
        • 3.1.5 5G Infrastructure
        • 3.1.6 Automotive
      • 3.2 BGA Market Projections
    • 4 CSP Applications and Markets
      • 4.1 Smartphones
        • 4.1.1 Apple iPhone 12 Pro
        • 4.1.2 Samsung Galaxy S20 Ultra 5G
        • ​4.1.3 Google Pixel 4a
      • 4.2 Tablets
        • 4.2.1 Apple iPad Pro 11-inch
        • ​4.2.2 Samsung Galaxy Tab Active Pro
      • 4.3 Laptops
        • 4.3.1 Google Pixelbook Go
        • 4.3.2 Samsung Galaxy Book S
        • 4.3.3 Apple MacBook Air
      • 4.4 Wearables
        • 4.4.1 Apple Watch Series 6
        • 4.4.2 Huami Amazfit GTS Smartwatch
        • 4.4.3 Samsung Galaxy Buds+
      • 4.5 Package Trends
        • 4.5.1 QFNs
          • 4.5.1.1 Cu Clip QFN/DFN
        • 4.5.2 Molded Interconnect Substrates
        • 4.5.3 Laminate CSPs
          • 4.5.3.1 FBGAs
          • 4.5.3.2 FLGAs
          • 4.5.3.3 Double-Sided FBGAs
        • 4.5.4 Stacked Die CSPs
        • 4.5.5 PoP Developments
      • 4.6 CSP Market Projections
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 2.1 Samsung's Cube options.
    • 3.1 Apple M1 processor package.
    • 3.2 AMD processor for desktop gaming.
    • 3.3 NXP FC-BGA for automotive.
    • 4.1 Samsung eMCP with 48Gb LPDDR4X and 128GB NAND.
    • 4.2 RDL-first PoP FO-WLP vs. laminate PoP.
    • 4.3 Generic flow mPoP.
  • Tables…
    • 1.1 End Product Growth
    • 2.1 2019 vs. 2020 in Local Currency and Converted to USD
    • 2.2 Revenue for Top 20 OSATs
    • 2.3 2020 Revenue Ranking of Top 20 OSATs
    • 2.4 Top 10 Assembly and Test Revenue Split
    • 2.5 Gross Margin for Top 10 OSAT Companies
    • 2.6 OSAT R&D Spending
    • 2.7 CAPEX for Top 10 OSATs
    • 2.8 Top 4 OSAT CAPEX Trends
    • 3.1 AI Applications
    • 3.2 PBGA/LGA Market Projections
    • 4.1 Apple iPhone 12 Pro CSPs
    • 4.2 CSPs in iPhone 11 Pro vs. iPhone 12 Pro
    • 4.3 Samsung Galaxy S20 Ultra 5G CSPs
    • 4.4 CSPs in Galaxy S20 Ultra 5G vs. S10 5G
    • 4.5 Select CSPs in Google Pixel 4a
    • 4.6 CSPs in 2020 Apple iPad Pro 11-inch
    • 4.7 Select CSPs in Apple iPad Pro 11-inch
    • 4.8 Select CSPs in Samsung Galaxy Tab Active Pro
    • 4.9 CSPs in Google Pixelbook Go Motherboard
    • 4.10 Select CSPs in Google Pixelbook Go
    • 4.11 Samsung Galaxy Book S CSPs
    • 4.12 Select CSPs in Galaxy Book S
    • 4.13 Select CSPs in Apple MacBook Air
    • 4.14 Apple Watch Series 5 and 6 Compared
    • 4.15 Select CSPs in Apple Watch Series 6
    • 4.16 Select CSPs in Huami Amazfit GTS Smartwatch
    • 4.17 Select CSPs in Samsung Galaxy Buds+
    • 4.18 QFN Examples
    • 4.19 SON/DFN Examples
    • 4.20 OSATs with QFN/DFN Cu Clip Attach
    • 4.21 Market Growth for QFN Cu Clip
    • 4.22 Market Growth for MIS Packages
    • 4.23 FBGA Examples
    • 4.24 FLGA Examples
    • 4.25 Double-Sided FBGA Examples
    • 4.26 Stacked Die CSP Examples
    • 4.27 PoP Market Forecast
    • 4.28 CSP Market Projections

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  • Published May 2021
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