SiP for Mobile and Wearable Applications

Market Forecasts and the Changing Business Model
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With the proliferation of mobile electronic products and the ongoing push for greater functionality in a smaller area, miniaturization has become a key word for system-in-package (SiP). SiP is defined as two or more dissimilar die, typically combined with other components such as passives, filters, MEMS, sensors or antennas, assembled into a standard package format to create a functional system or subsystem. SiPs are found in smartphones, tablets, wearable electronics (including medical products), and other consumer products. High-performance gaming systems, computers, and network systems also use SiP, as do automotive electronics and future connectivity products. Drivers differ depending on the application and include form factor, need for highly integrated solutions, low-power requirements, shielding, and cost.

This report examines products using SiP and the constructions found in today’s applications. Potential changes to business models are addressed. The 76-page report with full references provides forecasts for the SiP market in units by application and package type. Key requirements for SiP are examined and the roles of design, EMI shielding, and known good die are discussed. Assembly service providers are listed.

A set of PowerPoint slides accompanies the report.
  • Contents…
    • Executive Summary
      • Drivers for SiP Adoption
      • SiP Applications
      • Key Requirements for SiP
      • Market Projections and Future Growth
    • 1 Introduction: What's SiP
      • 1.1 Definition of SiP: Different Perspectives
        • 1.1.1 OSAT View
        • 1.1.2 EMS, IDM, and System Maker View
      • 1.2 SiP Defined
      • 1.3 Drivers for SiP
      • 1.4 A Changing Industry
    • 2 SiP Applications
      • 2.1 RF
      • 2.2 Image Sensors
      • 2.3 Motion Sensors
      • 2.4 BGA SSDs
      • 2.5 Modems
      • 2.6 Wireless Connectivity
        • 2.6.1 TDK's Tiny Bluetooth SiP
        • 2.6.2 Qualcomm Wi-Fi/Bluetooth SiP
        • 2.6.3 NFC Stacked eSE Chips
        • 2.6.4 Toshiba TransferJet™
      • 2.7 Control Modules
        • 2.7.1 Intel Curie™ Module
        • 2.7.2 Samsung Artik™ 1
      • 2.8 Power Management
      • ​2.9 Drones
      • 2.10 Medical Electronics and Healthcare
        • 2.10.1 Toshiba Silmee™
        • 2.10.2 Heart-rate Sensors
        • 2.10.3 IPDiA
        • 2.10.4 Microsemi Radio Module
      • 2.11 High Performance
        • 2.11.1 Silicon Interposer
          • 2.11.1.1 AMD Radeon™ R9 Fury "Fiji" & GPU
          • 2.11.1.2 Altera's EMIB Design
          • 2.11.1.3 Xilinx Heterogeneous Modules
        • 2.11.2 High Performance Memory
          • 2.11.2.1 Micron
          • 2.11.2.2 Tezzaron
          • 2.11.2.3 Samsung
          • 2.11.2.4 SK Hynix
      • 2.12 Automotive Electronics
        • 2.12.1 Tire Pressure Sensors
        • 2.12.2 In-Vehicle Networks
        • 2.12.3 ADAS
          • 2.12.3.1 Radar Modules
          • 2.12.3.2 Future Image Processing Modules
      • ​2.13 Future IoT Applications
        • 2.13.1 Industrial IoT
        • 2.13.2 Smart Homes
    • 3 Key Requirements for SiP
      • 3.1 SiP Design and EDA Tools
      • 3.2 EMI Shielding
      • 3.3 Antenna Design
      • 3.4 Known Good Substrates
      • 3.5 Known Good Die
    • ​4 Changing Business Models
      • 4.1 Electronic Manufacturing Services
      • 4.2 OSAT
      • 4.3 SiP Business Models
    • 5 SiP Market Forecast
    • 6 Contract Assembly Services
  • Figures…
    • Block Diagram of iPhone 6s
    • Apple watch S1 SiP module
    • Logic and memory stack in Apple Watch
    • Sony's stacked image sensor and logic
    • How sensor data fusion works
    • InvenSense tri-core 6-axis motion sensor hub
    • Integrated BGA SSD compared to eMMC
    • TDK's tiny Bluetooth smart SiP with embedded die
    • Toshiba TransferJet™ module
    • Samsung Artik™ 1
    • Samsung Artik™ 1 block diagram
    • Marvell's FO-WLP as SiP
    • SESUB® power management unit from TDK-EPC
    • TI DC/DC converter with AT&S ECP® technology
    • TI's PowerStack™ with Cu Clip
    • Toshiba Silmee™ vital signs sensor
    • Integration density of AFE pseudo-SoC
    • Microsemi's SiP
    • AMD's Fiji with silicon interposer and HBM
    • 5mKGSD package for SK Hynix HBM
  • Tables…
    • SiPs in Mobile Devices
    • SiP Descriptions (Mobile, Wearable, and Consumer)
    • Mobile, Wearable, and Consumer SiPs
    • SiP Volume by Package Type (millions of packages)
    • Computing, Communications, and Automotive SiPs
    • OSAT SiP Definitions
    • System Makers, IDMs, and EMS SiP Definitions
    • Reasons for SiP Adoption
    • SiPs in Mobile Devices
    • RF Components in the iPhone 6s Packaged as SiP
    • MEMS Motion Sensors Counted as SiP
    • LTE Modem Miniaturization with SiP
    • Intel Curie™ for IoT and wearable applications
    • Power-Related SiPs
    • Embedded Die Technology Features and Benefits
    • Examples of Commercial EDA Tools for SiP
    • OSAT Package EMI Shielding Options
    • EMI Package Metal Shield Process Methods
    • Product Image and Product Specifications
    • SiP Substrate Features
    • Mobile, Wearable, and Consumer SiPs
    • SiP Descriptions (Mobile, Wearable, and Consumer)
    • Computing, Communications, and Automotive SiPs
    • SiP (Computing, Communications, Automotive)
    • SiP Volume by Package Type
    • OSATs and EMS Offering SiP Assembly
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brochure
  • Published February 2016
  • 76 pages
  • 20 figures / 26 tables
  • 49 PowerPoint slides
  • $4,995 single user
    $8,500 corporate license
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