Volume 3-1119

November 2019
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This issue of the Advanced Packaging Update features special coverage of outsourced semiconductor assembly and test (OSAT) financials for the first half of 2019. It includes a special section on the 5G infrastructure rollout, an update on the developments in high bandwidth memory, and coverage of new developments in the use of chiplets. A look inside Apple’s new iPhone 11 Pro is included.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
      • 1.2 Semicondcutor Sector
    • ​2 OSAT Financial Analysis
      • 2.1 Definitions
      • 2.2 OSAT Market Overview
        • 2.2.1 Second Quarter 2019 Market Performance
        • 2.2.2 Test
      • 2.3 Metrics
        • 2.3.1 Gross Margin
        • 2.3.2 Research and Development
        • 2.3.3 Capital Investment
      • 2.4 Outlook
    • 3 Apple's iPhone 11 Pro
    • 4 Chiplet Developments
      • 4.1 TSMC
      • 4.2 AMD
      • 4.3 Intel
      • 4.4 DARPA
      • 4.5 L3MATRIX
      • 4.6 zGlue
    • 5 High-Density Bridge Developments
      • 5.1 Intel
      • 5.2 IBM Research
      • 5.3 SPIL
    • 6 High Bandwidth Memory
      • 6.1 HBM Applications
        • 6.1.1 Huawei
        • 6.1.2 Intel's Nervana™
        • 6.1.3 NVIDIA
        • 6.1.4 Xilinx
      • 6.2 Suppliers of HBM
        • 6.2.1 Samsung
        • 6.2.2 SK Hynix
        • 6.2.3 Renesas
        • 6.2.4 PowerTech Technology
      • 6.3 HBM Supply and Demand
    • 7 5G Developments
      • 7.1 Infrastructure Equipment Providers
      • 7.2 Rollout Issues
      • 7.3 ;Differences for 5G mmWave
        • 7.3.1 IBM Assembly and Test Services
        • 7.3.2 Intel
        • 7.3.3 JCET
        • 7.3.4 Murata
      • 7.4 Filters
      • 7.5 PCB Demand
      • 7.6 PCB Materials
      • 7.7 Testing in a 5G Era
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 4.1 Intel's Lakefield Hybrid CPU.
    • 4.2 Chiplet process integrating the optical interconnect with ASIC switch.
    • 4.3 zGlue integration platform.
    • 7.1 SiP for 5G base station.
    • 7.2 Intel's 5G mmWave module.
    • 7.3 5G Infrastructure AiP.
  • Tables…
    • 2.1 Revenues for Top 20 OSATs
    • 2.2 Quarterly Revenues for Top 20 OSATs
    • 2.3 Test and Assembly Revenue for Top 10 OSATs
    • 2.4 Gross Margins for Top 10 OSATs
    • 2.5 R&D Investment for Top 10 OSATs
    • 2.6 2019 YTD CAPEX for Top 10 OSATs
    • 3.1 Apple A13 Bionic and DRAM PoP Metrics
    • 4.1 SoIC Compared to 2.5D and Conventional 3D IC Options
    • 6.1 HBM Features
    • 6.2 Products Using HBM
    • 6.3 HBM Market Projections
    • 7.1 RF360 Hexaplexer Combines Three Filter Types
    • 7.2 Comparison of PCB Material Factors by 5G Frequency Domain
    • 7.3 Dielectric Constant and Loss Tangent for Selected Materials

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