- 1.1 Monthly U.S. housing starts.
- 4.1 Intel's Lakefield Hybrid CPU.
- 4.2 Chiplet process integrating the optical interconnect with ASIC switch.
- 4.3 zGlue integration platform.
- 7.1 SiP for 5G base station.
- 7.2 Intel's 5G mmWave module.
- 7.3 5G Infrastructure AiP.