This issue of the Advanced Packaging Update features special coverage of outsourced semiconductor assembly and test (OSAT) financials through the third quarter. The report presents options for high-performance packaging, including silicon interposers, fan-out on substrate, and other alternatives. Future 3D alternatives, including 3D stacking with TSVs and fusion bonding, are discussed. Developments in antenna-in-package are covered. Developments and applications in 3D-printed electronics are also presented.