Volume 4-0119

January 2019
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This issue of the Advanced Packaging Update features special coverage of outsourced semiconductor assembly and test (OSAT) financials through the third quarter. The report presents options for high-performance packaging, including silicon interposers, fan-out on substrate, and other alternatives. Future 3D alternatives, including 3D stacking with TSVs and fusion bonding, are discussed. Developments in antenna-in-package are covered. Developments and applications in 3D-printed electronics are also presented.
  • Contents…
    • 1 Industry and Economic Trends
      • ​1.1 Macroeconomic Trends
      • 1.2 Semiconductor Sector
    • ​2 OSAT Financial Analysis
      • ​2.1 OSAT Market Overview
    • 3 High-Performance Packaging
      • 3.1 High-Performance Packaging Options
        • 3.1.1 Silicon Interposers
        • 3.1.2 Challenges with Silicon Interposers
        • 3.1.3 Fan-Out on Substrate
        • 3.1.4 Organic Packages
          • 3.1.4.1 AMD's EPYC
          • 3.1.4.2 Intel's EMIB
        • 3.1.5 Supply and Demand Analysis
        • 3.1.6 What's Next? New 3D Architectures
          • 3.1.6.1 Intel Foveros Technology
          • 3.1.6.2 CEA Leti
          • 3.1.6.3 DARPA's CHIPS Program
          • 3.1.6.4 GLOBALFOUNDRIES
          • 3.1.6.5 TSMC 3DFO
          • 3.1.6.6 Direct or Fusion Bonding
    • ​4 RF FEM Trends
    • 5 5G Drives New Package Solutions
      • 5.1 Antenna-in-Package
        • 5.1.1 Amkor Technology
        • 5.1.2 ASE
        • 5.1.3 MediaTek
        • 5.1.4 Powertech Technology
        • 5.1.5 Qualcomm
        • 5.1.6 SPIL
        • 5.1.7 TSMC
    • ​6 3D Printed Electronics
      • 6.1 Centers for 3D Printed Electronics
      • 6.2 Printed Electronic Circuit Applications
      • 6.3 3D Printing and Additive Manufacturing
        • 6.3.1 Printed Antennas
        • 6.3.2 Cooling
      • 6.4 Materials and Methods
        • 6.4.1 Inkjet Printing
      • 6.5 Equipment Suppliers
        • 6.5.1 BotFactory
        • 6.5.2 Fuji Machine Manufacturing
        • 6.5.3 Hewlett-Packard
        • 6.5.4 Meyer Burger
        • 6.5.5 Nano Dimension
        • 6.5.6 Next Dynamics
        • 6.5.7 Optomec
        • 6.5.8 Orbotech
        • 6.5.9 SCREEN Holdings
        • 6.5.10 Toray Engineering
        • 6.5.11 Voxel8
    • ​2018 BGA and CSP Bibliography
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 3.1 Google’s TPU v3.
    • 3.2 EPYC multi-die package.
    • 3.3 Foveros technology with 3D face-to-face stacking.
    • 3.4 Intel first hybrid x86 architecture in Foveros.
    • 3.5 3D test vehicle with conformal lid technology.
    • 5.1 Cross-section of mmWave transceiver on FC-CSP.
    • 5.2 AiP stack-up.
  • Tables…
    • 2.1 Top 20 OSAT Revenues
    • 3.1 Key Metrics for High-Performance Packaging
    • 3.2 Silicon Interposer with TSVs vs. Alternatives
    • 3.3 Passive Si Interposers with TSVs in Production
    • 3.4 Package Comparison
    • 3.5 Market Projections for Si Interposers and Fan-Out on Substrate
    • 3.6 3DFO versus Conventional 3DIC
    • 4.1 Comparison of RF FEMs in iPhone X and iPhone XS/XS Max
    • 6.1 Equipment Suppliers
Stacks Image 25201
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  • Published January 2019
  • 41 pages
  • 8 figures / 9 tables
  • 48 PowerPoint slides
  • $5,100 annual subscription (4 issues)
    $2,500 single issue
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