Volume 2-0820

August 2020
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This issue of the Advanced Packaging Update presents new developments in advanced packaging substrates, including challenges in the development of high- density RDL interposers. Demand for flip chip BGA substrates taking into account build-up layer count is provided. The latest projection for fan-out wafer level packages (FO-WLPs) is provided. New package developments in the automotive electronics sector are presented. A special section on developments in photonics packaging is included.
  • Contents…
    • 1 Industry and Economic Trends
      • 1.1 Economic Trends
        • 1.1.1 U.S. Macroeconomic Trends
      • 1.2 Semiconductor Industry Growth
        • 1.2.1 TSMC's Outlook
      • 1.3 Trade Agreements and Trade Friction
      • 1.4 Growth Areas
        • 1.4.1 Smartphones and 5G Adoption
        • 1.4.2 5G Infrastructure
        • 1.4.3 Datacenters and Servers
        • 1.4.4 Automotive Electronics
    • ​2 OSAT Market Sector
    • 3 Fan-out WLP Outlook
      • 3.1 Standard-Density FO-WLP
      • 3.2 High-Density FO-WLP
        • 3.2.1 TSMC's InFO
        • 3.2.2 Samsung's FOPLP
        • 3.2.3 Fan-out on Substrate
          • Amkor Technology
          • ASE
          • SPIL
          • TSMC
          • Tongfu Microelectronics
      • 3.3 FO-WLP Market Forecast
    • 4 Substrate Trends
      • 4.1 Larger Body Sizes
      • 4.2 Finer Features
      • 4.3 Higher Layer Counts
      • 4.4 Substrate Panel Requirements
      • 4.5 Increased Substrate Capacity
    • 5 Integrated Passive Developments
      • 5.1 Technology Overview
        • 5.1.1 Company Activities
          • Intel
          • Samsung
          • A*STAR
          • TSMC
    • ​​6 Integrated Photonics Packaging
      • 6.1 Packaging for Integrated Photonics
      • 6.2 Industry Activities
        • 6.2.1 Cisco
        • 6.2.2 GLOBALFOUNDRIES
        • 6.2.3 HPE Horizonal Si Photonics Ecosystem
        • 6.2.4 Infinera
        • 6.2.5 Intel's Silicon Photonic Switches
        • 6.2.6 Juniper Networks
        • 6.2.7 Microsoft
        • 6.2.8 POET Technologies
        • 6.2.9 Ranovus
        • 6.2.10 Rockley Photonics
        • 6.2.11 SCINTIL Photonics
      • 6.3 Research Organizations
        • 6.3.1 CEA Leti
        • 6.3.2 Fraunhofer IZM
        • 6.3.3 IBM Watson Research Center
        • 6.3.4 IMEC Transfer Printing for Silicon Photonics
        • 6.3.5 iNEMI's Optoelectronics Roadmap
        • 6.3.6 Microsoft/Facebook Co-Packaged Optics Collaboration
        • 6.3.7 PETRA
        • 6.3.8 Tyndall National Institute
        • 6.3.9 USC Packaging for High-Speed Transceivers
      • 6.4 EDA Tools
        • 6.4.1 Ansys
        • 6.4.2 Cadence
        • 6.4.3 Mentor Graphics
        • 6.4.4 Synopsys
      • 6.5 OSAT Activities
        • 6.5.1 AIM Photonics
        • 6.5.2 Amkor Technology
        • 6.5.3 ASE
        • 6.5.4 Argotech
        • 6.5.5 IBM Assembly and Test Services
        • 6.5.6 Integra
        • 6.5.7 PHIX Photonics Assembly
        • 6.5.8 Technobis Group
      • 6.6 Market for Integrated Photonics
    • References
  • Figures…
    • 1.1 Monthly U.S. housing starts.
    • 3.1 Substrate-SWIFT® shows lower insertion loss than silicon interposer.
    • 3.2 FOEB package with bridge die.
    • 3.3 TFME FOPoS.
    • 5.1 Capacitors on interposer inside the package.
    • 5.2 Intel’s MIA inductors.
    • 5.3 Samsung’s 3D wafer stacking process for logic chip plus ISC capacitor.
    • 5.4 Applications for Samsung's ISC.
    • 6.1 Transition from Cu wiring to photonics.
    • 6.2 Photonic SMT package.
    • 6.3 ASIC/transceiver integration concept.
    • 6.4 HPE's fiber-to-chip connector.
    • 6.5 Intel co-packaged optics Ethernet switch.
    • 6.6 COSMICC 100 Gb/s demonstrator.
    • 6.7 3D router optoelectronic chip mounted to an optical PCB.
    • 6.8 IBM 8x8 photonic switch module.
    • 6.9 Fiber-last assembly process for IBM 8x8 optical switch module.
    • 6.10 Transceiver integration schemes.
    • 6.11 Mentor Graphics' integrated photonics design flow.
  • Tables…
    • 2.1 Revenue of Top 20 Publicly Traded OSATs
    • 2.2 Revenue of Top 20 Publicly Traded OSATs
    • 2.3 Top 20 OSAT Market Share by Headquarter Region
    • 2.4 Revenue Projections by Region
    • 2.5 Revenue Sensitivity Analysis
    • 3.1 Fan-Out Suppliers
    • 3.2 Fan-out WLP Examples
    • 3.3 Trends for Apple’s Application Processors in TSMC’s InFO
    • 3.4 InFO-R versus InFO-L
    • 3.5 FO-WLP Market Projections in Units
    • 3.6 FO-WLP Market Projections in Reconstituted Wafers
    • 4.1 High-Performance Substrate Build-up Material Requirements
    • 6.1 Package Variations Using GLOBALFOUNDRIES PIC Technology
    • 6.2 Optical Implementation and Packaging Approaches
    • 6.3 Comparison of Hybrid and Monolithic Integration for Various Technologies

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