TechSearch International | Advanced Packaging Update

Volume 4-0218

February 2018

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This issue of the Advanced Packaging Update features special coverage of the market with a forecast for units of BGAs and CSPs by package construction. The CSP market is divided into laminate and leadframe (QFN) substrates. Unit growth projections for package-on-package (PoP) are provided. Estimates of the market for each package type are based on input from captive as well as merchant assembly operations. Drivers for growth in each segment are discussed and the impact of cryptocurrency is analyzed. A special section is devoted to 5G and the requirements for packages and materials. An economic analysis examines macroeconomic trends and their impact on the semiconductor packaging and assembly industry.

Contents…
1 Industry and Economic Trends

1.1 Economic Trends

1.2 Semiconductor Fab Sector

1.3 Assembly and Test Sector

2 Cryptocurrency

3 BGA Applications and Market Growth

3.1 Personal Computers

3.2 Network Systems, Telecom, and Servers

3.3 Automotive

3.4 Set-Top Boxes, HDTVs, and Game Consoles

3.5 BGA Market Projections

4 CSP Applications and Markets

4.1 Mobile Phones

4.2 Tablets

4.3 Game Consoles and VR/AR Headsets

4.4 Drones

4.5 Wearable Electronics

4.6 QFNs

4.7 Molded Interconnect Substrates

4.8 Laminate CSPs

4.9 Stacked Die CSPs

4.10 PoP Developments

4.11 CSP Market Projections

5 5G Developments

5.1 IoT Drivers for 5G

5.2 Mobile Devices and 5G

5.3 MIMO Antennas

5.4 5G Systems and Module Designs

5.5 5G Rollout and Examples

2017 BGA and CSP Bibliography

References
Figures…
1.1 Monthly U.S. housing starts.

2.1 Bitmain's Antminer T9.

3.1 Intel's PoINT package cross-section.

4.1 Construction of iPhone X logic board stack.

4.2 TSMC's InFO PoP.

5.1 Holistic system integration platform for 5G.
Tables…
1.1 Top 20 OSAT Revenues

2.1 Cryptocurrency Flip Chip Package Forecast

3.1 Large Die FC-BGA Test Vehicle

3.2 Property Comparison of Different TIM

3.3 Examples of PBGA Packages for Automotive Electronics

3.4 PBGA/LGA Market Projections

4.1 Select CSPs in Apple iPhone 8/8 Plus

4.2 Examples of CSPs in iPhone X

4.3 iPhone 8 Plus and iPhone X Compared

4.4 Select CSPs in Samsung’s Galaxy S8+

4.5 Select CSPs in Huawei Mate 9

4.6 Select CSPs in Xiaomi Mi 6

4.7 Examples of CSPs in Nintendo’s Switch

4.8 Examples of CSPs in DJI Phantom 4 Advanced Drone

4.9 Examples of CSPs in Samsung Gear Sport (SM-R600)

4.10 Select CSPs in the Apple Watch Series 2

4.11 Select CSPs in the Fitbit Charge 2

4.12 QFN Examples

4.13 FBGA Examples

4.14 LGA-Package Examples

4.15 Stacked Die CSP Examples

4.16 PoP Market Forecast

4.17 CSP Market Projections

5.1 NB-IoT, LoRa, and Sigfox Modules

Advanced Packaging Update

Market and Technology Trends

Volume 4-0218

February 2018