The Advanced Packaging Update (1-0317) features special coverage of outsourced assembly and test (OSAT) financials. A detailed financial analysis of the industry is provided, including a discussion of merger and acquisition activities and the impact on the industry. An update on the latest developments in large area fan-out wafer level package (FO-WLP) panel production is included. A section on trends in packaging and assembly for memory covers new developments. The latest trends in high-performance computing are presented with a forecast for silicon interposers and a discussion of alternatives moving into production.